WF128K32-XXX5
PACKAGE 400: 66 PIN, PGA TYPE, CERAMIC HEX-IN-LINE PACKAGE, HIP (H1)
27.3 (1.075) ± 0.25 (0.010) SQ
PIN 1 IDENTIFIER
SQUARE PAD
ON BOTTOM
25.4 (1.0) TYP
4.34 (0.171)
MAX
3.81 (0.150)
± 0.13 (0.005)
1.42 (0.056) ± 0.13 (0.005)
0.76 (0.030) ± 0.13 (0.005)
2.54 (0.100)
TYP
1.27 (0.050) TYP DIA
15.24 (0.600) TYP
25.4 (1.0) TYP
0.46 (0.018) ± 0.05 (0.002) DIA
ALL LINEAR DIMENSIONS ARE MILLIMETERS AND PARENTHETICALLY IN INCHES
PACKAGE 502: 68 LEAD, CERAMIC QUAD FLAT PACK, LOW PROFILE CQFP (G4T)
3.56 (0.140) MAX
39.6 (1.56) ± 0.38 (0.015) SQ
PIN 1 IDENTIFIER
Pin 1
7
12.7 (0.500)
± 0.5 (0.020)
4 PLACES
5.1 (0.200)
± 0.25 (0.010)
4 PLACES
0.25 (0.010)
± 0.05 (0.002)
0.38 (0.015)
1.27 (0.050)
TYP
± 0.08 (0.003)
68 PLACES
38 (1.50) TYP
4 PLACES
ALL LINEAR DIMENSIONS ARE MILLIMETERS AND PARENTHETICALLY IN INCHES
11
White Microelectronics • Phoenix, AZ • (602) 437-1520