WEDPS512K32V-XBX
512Kx32 SRAM 3.3V MULTI-CHIP PACKAGE
FEATURES
Access Times of 12, 15, 17, 20ns
Packaging
• 143 PBGA, 16mm x 18mm, 288mm
2
Organized as 512Kx32; User Configurable as 1Mx16 or
2Mx8
Commercial, Industrial and Military Temperature Ranges
Low Voltage Operation:
• 3.3V ± 10% Power Supply
This product is subject to change without notice.
Low Power Data Retention 'L' Option
TTL Compatible Inputs and Outputs
Fully Static Operation:
• No clock or refresh required.
Three State Output.
PIN CONFIGURATION FOR WEDPS512K32V-XBX
Top View
1
A
B
C
D
E
F
G
H
J
K
L
M
-
CS2#
D9
D10
WE2#
GND
V
CC
CS1#
D1
D2
WE1#
GND
2
A2
A3
D8
D11
GND
GND
V
CC
V
CC
D0
D3
A6
A7
3
A1
A4
NC
GND
GND
GND
V
CC
V
CC
V
CC
NC
A5
A8
4
A0
D14
D12
GND
GND
GND
V
CC
V
CC
V
CC
D7
D6
A9
5
GND
D15
D13
GND
GND
GND
V
CC
V
CC
V
CC
D5
D4
V
CC
6
GND
NC
GND
GND
GND
GND
V
CC
V
CC
V
CC
V
CC
NC
V
CC
7
V
CC
CS4#
V
CC
V
CC
V
CC
V
CC
GND
GND
GND
GND
WE3#
GND
8
V
CC
D24
D26
V
CC
V
CC
V
CC
GND
GND
GND
D17
D19
GND
9
A18
D25
D27
V
CC
V
CC
V
CC
GND
GND
GND
D16
D18
A10
10
A17
OE#
WE4#
V
CC
V
CC
V
CC
GND
GND
GND
CS3#
A14
A11
11
A16
A15
D31
D28
V
CC
V
CC
GND
GND
D23
D20
A13
A12
12
GND
NC
D30
D29
NC
V
CC
GND
NC
D22
D21
NC
V
CC
Pin Description
I/O
0-31
A
0-18
WE
1-4
#
CS
1-4
#
OE#
V
CC
GND
NC
Data Inputs/Outputs
Address Inputs
Write Enables
Chip Selects
Output Enable
Power Supply
Ground
Not Connected
8
512K X 8
OE#
A
0-18
WE
1
# CS
1
#
Block Diagram
WE
2
# CS
2
#
WE
3
# CS
3
#
WE
4
# CS
4
#
512K X 8
512K X 8
512K X 8
8
8
8
I/O
0 - 7
I/O
8 - 15
I/O
16 - 23
I/O
24 - 31
Microsemi Corporation reserves the right to change products or specifications without notice.
May 2011
Rev. 6
© 2011 Microsemi Corporation. All rights reserved.
1
Microsemi Corporation • (602) 437-1520 • www.microsemi.com
MERCURY [ MERCURY UNITED ELECTRONICS INC ]
