WEDPS512K32V-XBX
Document Title
512K x 32 SRAM PBGA Multi-Chip Package
Revision History
Rev #
History
Release Date Status
Rev 0
Initial Release
March 2002
Advanced
Rev 1
Rev 2
Rev 3
Changes (Pg. 1)
March 2002
Advanced
1.1 Switch Rows and Columns header position
Changes (Pg. 1)
May 2002
May 2002
Advanced
Advanced
2.1 Switch Rows and Columns header position (Pg. 1)
Changes (Pg. 1, 5)
3.1 Remove excess white space from package drawing for to create a consistent
accurate style.
Rev 4
Changes (Pg. 1, 2, 7)
January 2003
Final
4.1 Add Thermal Resistance Table
4.2 Change product status to Final
Rev 5
Rev 6
Changes (Pg. 1, 2, 6, 7)
June 2004
May 2011
Final
Final
5.1 Add low power data retention option
Changes (Pg. 1-7)
6.1 Change document layout from White Electronic Designs to Microsemi
Microsemi Corporation reserves the right to change products or specifications without notice.
May 2011 © 2011 Microsemi Corporation. All rights reserved.
Rev. 6
7
Microsemi Corporation • (602) 437-1520 • www.microsemi.com
MERCURY [ MERCURY UNITED ELECTRONICS INC ]
