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W3H128M72E2-400SBM 参数 Datasheet PDF下载

W3H128M72E2-400SBM图片预览
型号: W3H128M72E2-400SBM
PDF下载: 下载PDF文件 查看货源
内容描述: [DDR DRAM, 128MX72, 1.35ns, CMOS, PBGA208, BGA-208]
分类和应用: 动态存储器双倍数据速率内存集成电路
文件页数/大小: 31 页 / 1030 K
品牌: MERCURY [ MERCURY UNITED ELECTRONICS INC ]
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W3H128M72E-XSBX / W3H128M72E-XNBX  
DESCRIPTION  
GENERAL NOTES  
The 8Gb DDR2 SDRAM is a high-speed CMOS, dynamic random-  
access memory containing ve 2Gb 2,147,483,648 bits chips. Each  
of the ve chips in the MCP are internally congured as 8-bank  
DRAM. The block diagram of the device is shown in Figure 2. Ball  
assignments are shown in Figure 3.  
The functionality and the timing specications discussed in this  
data sheet are for the DLL-enabled mode of operation.  
Throughout the data sheet, the various gures and text refer to  
DQs as “DQ.” The DQ term is to be interpreted as any and all  
DQ collectively, unless specically stated otherwise. Additionally,  
each chip is divided into 2 bytes, the lower byte and upper byte.  
For the lower byte (DQ0–DQ7), DM refers to LDM and DQS  
refers to LDQS. For the upper byte (DQ8–DQ15), DM refers to  
UDM and DQS refers to UDQS. Note that the there is no upper  
byte for U4 and therefore no UDM4.  
The 8Gb DDR2 SDRAM uses a double-data-rate architecture to  
achieve high-speed operation. The double data rate architecture is  
essentially a 4n-prefetch architecture, with an interface designed  
to transfer two data words per clock cycle at the I/O balls. A single  
read or write access for the 8Gb DDR2 SDRAM effectively consists  
of a single 4n-bit-wide, one-clock-cycle data transfer at the internal  
DRAM core and four corresponding n-bit-wide, one-half-clock-cycle  
data transfers at the I/O balls.  
Complete functionality is described throughout the document  
and any page or diagram may have been simplied to convey a  
topic and may not be inclusive of all requirements.  
A bidirectional data strobe (DQS, DQS#) is transmitted externally,  
along with data, for use in data capture at the receiver. DQS is a  
strobe transmitted by the DDR2 SDRAM during READs and by the  
memory controller during WRITEs. DQS is edge-aligned with data  
for READs and center-aligned with data for WRITEs. Two strobes  
per chip, one for the lower byte (LDQS, LDQS#) and one for the  
upper byte (UDQS, UDQS#).  
Any specic requirement takes precedence over a general  
statement.  
INITIALIZATION  
DDR2 SDRAMs must be powered up and initialized in a  
predened manner. Operational procedures other than those  
specied may result in undened operation. The following  
sequence is required for power up and initialization and is  
shown in Figure 4 on page 6.  
The 8Gb DDR2 SDRAM operates from a differential clock (CK and  
CK#); the crossing of CK going HIGH and CK# going LOW will  
be referred to as the positive edge of CK. Commands (address  
and control signals) are registered at every positive edge of CK.  
Input data is registered on both edges of DQS, and output data is  
referenced to both edges of DQS, as well as to both edges of CK.  
Read and write accesses to the DDR2 SDRAM are burst oriented;  
accesses start at a selected location and continue for a programmed  
number of locations in a programmed sequence. Accesses begin  
with the registration of anACTIVE command, which is then followed  
by a READ or WRITE command. The address bits registered  
coincident with the ACTIVE command are used to select the bank  
and row to be accessed. The address bits registered coincident  
with the READ or WRITE command are used to select the bank  
and the starting column location for the burst access.  
The DDR2 SDRAM provides for programmable read or write  
burst lengths of four or eight locations. DDR2 SDRAM supports  
interrupting a burst read of eight with another read, or a burst  
write of eight with another write. An auto precharge function may  
be enabled to provide a self-timed row precharge that is initiated  
at the end of the burst access.  
As with standard DDR SDRAMs, the pipelined, multibank  
architecture of DDR2 SDRAMs allows for concurrent operation,  
thereby providing high, effective bandwidth by hiding row precharge  
and activation time.  
Aself refresh mode is provided, along with a power-saving power-  
down mode.  
All inputs are compatible with the JEDEC standard for SSTL_18.  
All full drive-strength outputs are SSTL_18-compatible.  
5
4163.12E-0716-ss-W3H128M72E-XSBX / XNBX  
Mercury Corp. - Memory and Storage Solutions • (602) 437-1520 • www.mrcy.com