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W3E64M72S-200SBI 参数 Datasheet PDF下载

W3E64M72S-200SBI图片预览
型号: W3E64M72S-200SBI
PDF下载: 下载PDF文件 查看货源
内容描述: [DDR DRAM, 64MX72, 0.8ns, CMOS, PBGA219, 25 X 32 MM, PLASTIC, BGA-219]
分类和应用: 动态存储器双倍数据速率内存集成电路
文件页数/大小: 19 页 / 496 K
品牌: MERCURY [ MERCURY UNITED ELECTRONICS INC ]
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W3E64M72S-XSBX  
White Electronic Designs  
DENSITY COMPARISONS  
ACTUAL SIZE  
25  
White Electronic Designs  
W3E64M72S-XSBX  
32  
Area = 800mm2  
I/O Count = 219 Balls  
SAVINGS – Area: 66% – I/O Count: 55%  
Discrete Approach  
11.9  
11.9  
11.9  
11.9  
11.9  
11.9  
11.9  
11.9  
11.9  
54  
TSOP  
54  
TSOP  
54  
TSOP  
54  
TSOP  
54  
TSOP  
54  
TSOP  
54  
TSOP  
54  
TSOP  
54  
TSOP  
22.3  
Area: 9 x 265mm2 = 2,385mm2  
I/O Count: 9 x 54 pins = 486 pins  
Read and write accesses to the DDR SDRAM are burst  
oriented; accesses start at a selected location and continue  
for a programmed number of locations in a programmed  
sequence. Accesses begin with the registration of an  
ACTIVE command, which is then followed by a READ or  
WRITE command. The address bits registered coincident  
with the ACTIVE command are used to select the bank  
and row to be accessed. The address bits registered  
coincident with the READ or WRITE command are used  
to select the bank and the starting column location for the  
burst access.  
saving power-down mode. All inputs are compatible with  
the Jedec Standard for SSTL_2. All full drive options  
outputs are SSTL_2, Class II compatible.  
FUNCTIONAL DESCRIPTION  
Read and write accesses to the DDR SDRAM are burst  
oriented; accesses start at a selected location and continue  
for a programmed number of locations in a programmed  
sequence. Accesses begin with the registration of an  
ACTIVE command which is then followed by a READ or  
WRITE command. The address bits registered coincident  
with theACTIVE command are used to select the bank and  
row to be accessed (BA0 and BA1 select the bank, A0-12  
select the row). The address bits registered coincident  
with the READ or WRITE command are used to select the  
starting column location for the burst access.  
The DDR SDRAM provides for programmable READ  
or WRITE burst lengths of 2, 4, or 8 locations. An auto  
precharge function may be enabled to provide a self-  
timed row precharge that is initiated at the end of the  
burst access.  
The pipelined, multibank architecture of DDR SDRAMs allows  
for concurrent operation, thereby providing high effective  
bandwidth by hiding row precharge and activation time.  
Prior to normal operation, the DDR SDRAM must be  
initialized. The following sections provide detailed  
information covering device initialization, register denition,  
command descriptions and device operation.  
An auto refresh mode is provided, along with a power-  
White Electronic Designs Corp. reserves the right to change products or specications without notice.  
September 2007  
Rev. 3  
2
White Electronic Designs Corporation • (602) 437-1520 • www.whiteedc.com