Voltage Controlled Temperature Compensated Crystal
Oscillators VCVCTCXO, VM57T Series, CMOS Output
MERCURY
Since 1973
Package Dimensions and Suggested Land Pattern:
Unit: mm
[0.275± 0.006]
7.00± 0.15
[0.024]
0.6
[0.055]
1.4
4
3
VM57T_
M E C
3
2
4
1
2
1
5.08 [0.200]
typical
Epoxy encapsulation
Bottom view
2.2[0.086]
Pad 1
Pad 2
Pad 3
Pad 4
Control voltage
Ground
Top view
Output
Supply voltage
5.08 [0.200]
Rounded pad is pad No. 1. Count counter-clockwise when looking at top view.
Count clockwise when looking at bottom view. 0.01 uF decoupling capacitor is built-in.
Recommended Reflow Soldering Profile
245°C liquidus 221°C solidus solder alloy is used in the assembly of VM57T products.
Do not exceed the reflow conditions given below
Profile A (low temperature solder reflow): For Sn62 Pb36 Ag2 and Sn63 Pb37 alloy.
250
230
200
183
Peak Temperature. Topside temperature of board to be 220°C min; 230°C max.
Liquidus Temperature
Flux Activation
Temperature
Time above 183°C
30~60 sec. max.
150
100
50
Soaking Zone
Pre-heat 2
Reflow
Zone
Pre-heat 1
Cooling
Time
(sec)
30
60
90
120 150 180 210 240 270 300 330
Soaking temp: 140°C~180°C
Soaking time: 60~90 sec.
Profile B (high temperature solder reflow): For Sn96.5% Ag 3.5% Cu 0.5% alloy.
Peak Temperature. Topside temperature of board to be 230°C min; 248°C max.
Liquidus Temperature
250
217
200
Flux Activation
Temperature
Time above 217°C
30~60 sec. max.
150
100
50
Soaking Zone
Pre-heat 2
Reflow
Zone
Pre-heat 1
Cooling
Time
(sec)
30
60
90
120 150 180 210 240 270 300 330
Soaking temp: 140°C~200°C
Soaking time: 90~120 sec.
MERCURY
Page 3 of 3
Date: May 1, 2008
Revision: 4
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