Voltage Controlled Temperature Compensated Crystal
Oscillators VCTCXO, VM53T Series, CMOS Output
MERCURY
Since 1973
Package Dimensions and Suggested Land Pattern:
Unit: mm
bottom view
5.0±0.2
2
3
1
4
1
0.1
1.2
1.4
Pad 1 Voltage Control
Pad 2 Ground
Pad 3 Output
Supply Voltage
Pad 4
2.4
Recommended Solder Reflow Profiles
245°C liquidus 221°C solidus solder alloy is used in the assembly of VM53T products.
Do not exceed the reflow conditions given below.
Profile A (low temperature solder reflow): For Sn62 Pb36 Ag2 and Sn63 Pb37 alloy.
250
230
Peak Temperature. Topside temperature of board to be 220°C min; 230°C max.
Liquidus Temperature
Flux Activation
200
183
Temperature
Time above 183°C
30~60 sec. max.
150
100
50
Soaking Zone
Pre-heat 2
Reflow
Zone
Pre-heat 1
Cooling
Time
(sec)
30
60 90 120 150 180 210 240 270 300 330
Soaking temp: 140°C~180°C
Soaking time: 60~90 sec.
Profile B (high temperature solder reflow): For Sn96.5% Ag 3.5% Cu 0.5% alloy.
Peak Temperature. Topside temperature of board to be 230°C min; 248°C max.
Liquidus Temperature
250
217
200
Flux Activation
Temperature
Time above 217°C
30~60 sec. max.
150
100
50
Soaking Zone
Pre-heat 2
Reflow
Zone
Pre-heat 1
Cooling
Time
(sec)
30
60 90 120 150 180 210 240 270 300 330
Soaking temp: 140°C~200°C
Soaking time: 90~120 sec.
MERCURY
Page 3 of 3
Date: May 1, 2008
Revision: 0
MERCURY [ MERCURY UNITED ELECTRONICS INC ]
