MLX90314
Programmable Sensor Interface
Reliability Information
This Melexis device is classified and qualified regarding soldering technology, solderability and moisture sen-
sitivity level, as defined in this specification, according to following test methods:
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IPC/JEDEC J-STD-020
Moisture/Reflow Sensitivity Classification For Nonhermetic Solid State Surface Mount Devices
(classification reflow profiles according to table 5-2)
EIA/JEDEC JESD22-A113
Preconditioning of Nonhermetic Surface Mount Devices Prior to Reliability Testing
(reflow profiles according to table 2)
CECC00802
Standard Method For The Specification of Surface Mounting Components (SMDs) of Assessed
Quality
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EIA/JEDEC JESD22-B106
Resistance to soldering temperature for through-hole mounted devices
EN60749-15
Resistance to soldering temperature for through-hole mounted devices
MIL 883 Method 2003 / EIA/JEDEC JESD22-B102
Solderability
For all soldering technologies deviating from above mentioned standard conditions (regarding peak tem-
perature, temperature gradient, temperature profile etc) additional classification and qualification tests have
to be agreed upon with Melexis.
The application of Wave Soldering for SMD’s is allowed only after consulting Melexis regarding assur-
ance of adhesive strength between device and board.
Based on Melexis commitment to environmental responsibility, European legislation (Directive on the
Restriction of the Use of Certain Hazardous substances, RoHS) and customer requests, Melexis has in-
stalled a Roadmap to qualify their package families for lead free processes also.
Various lead free generic qualifications are running, current results on request.
For more information on manufacturability/solderability see quality page at our website:
http://www.melexis.com/html/pdf/MLXleadfree-statement.pdf
MLX902xx Name of Sensor Rev Y.X 22/Aug/98
3901090314
Page 27
Page 27
Nov/04
Rev 007
MELEXIS [ Melexis Microelectronic Systems ]
