EVB72015
433MHz FSK/ASK Transmitter
Evaluation Board Description
7 Package Description
The device TH72015 is RoHS compliant.
D
D2
10
6
L
0.23
exposed pad
0.36
E2
E
0.225x45°
5
1
b
e
A3
The “exposed pad” is not connected
to internal ground,
it should not be connected to the PCB.
A
A1
Fig. 10: 10L QFN 3x3 Dual
all Dimensions in mm
D
E
D2
E2
A
A1
A3
L
e
b
min 2.85 2.85
max 3.15 3.15
2.23
2.48
1.49
1.74
0.80
1.00
0
0.05
0.3
0.5
0.18
0.30
0.20
0.50
all Dimensions in inch
min 0.112 0.112 0.0878 0.051 0.0315
max 0.124 0.124 0.0976 0.055 0.0393 0.002
0
0.0118
0.0197
0.0071
0.0118
0.0079
0.0197
7.1 Soldering Information
•
The device TH72015 is qualified for MSL3 with soldering peak temperature 260 deg C
according to JEDEC J-STD-20.
7.2 Recommended PCB Footprints
e
X
Y
all Dimensions in mm
CPL
Z
G
D2th
E2th
X
Y
CPL
e
10
1
6
5
min 3.55
max 3.90
1.9
2.3
3.2
3.6
1.3
1.7
0.25
0.30
0.7
1.0
0.3
0.5
0.5
Z
G
E2th
all Dimensions in inch
min 0.1398 0.0748 0.1260 0.0512 0.0098 0.0276 0.0591
max 0.1535 0.0906 0.1417 0.0669 0.0118 0.0394 0.0197
0.0197
D2th
solder pad
solder stop
Fig. 11: PCB land pattern style
39012 72015 01
Rev. 007
Page 13 of 14
EVB Description
June/07
MELEXIS [ Melexis Microelectronic Systems ]
