MX25U4035
MX25U8035
(20) Enter Secured OTP (ENSO) ...........................................................................................................................26
(21) Exit Secured OTP (EXSO) ..............................................................................................................................26
(22) Read Security Register (RDSCUR).................................................................................................................26
Table 8. Security Register Definition.......................................................................................................................27
(23) Write Security Register (WRSCUR)................................................................................................................27
(24) HOLD# pin function enable (HDE) ..................................................................................................................27
POWER-ON STATE...................................................................................................................................................28
ELECTRICAL SPECIFICATIONS..............................................................................................................................29
ABSOLUTE MAXIMUM RATINGS .........................................................................................................................29
Figure 2.Maximum Negative Overshoot Waveform................................................................................................29
CAPACITANCE TA = 25°C, f = 1.0 MHz.................................................................................................................29
Figure 3. Maximum Positive Overshoot Waveform.................................................................................................29
Figure 4. INPUT TEST WAVEFORMS AND MEASUREMENT LEVEL.................................................................. 30
Figure 5. OUTPUT LOADING................................................................................................................................30
Table 9. DC CHARACTERISTICS (Temperature = -40 C to 85 C, VCC = 1.65V ~ 2.0V) .................................... 31
°
°
Table 10. AC CHARACTERISTICS (Temperature = -40 C to 85 C, VCC = 1.65V ~ 2.0V) .................................. 32
°
°
Timing Analysis........................................................................................................................................................34
Figure 6. Serial Input Timing...................................................................................................................................34
Figure 7. Output Timing ..........................................................................................................................................34
Figure 8. WP# Setup Timing and Hold Timing during WRSR when SRWD=1 ....................................................... 35
Figure 9. Hardware Reset Timing...........................................................................................................................35
Figure 10. Write Enable (WREN) Sequence (Command 06) ................................................................................. 36
Figure 11. Write Disable (WRDI) Sequence (Command 04) ..................................................................................36
Figure 12. Read Identification (RDID) Sequence (Command 9F) .......................................................................... 36
Figure 13. Read Status Register (RDSR) Sequence (Command 05)..................................................................... 37
Figure 14. Write Status Register (WRSR) Sequence (Command 01)................................................................... 37
Figure 15. Read Data Bytes (READ) Sequence (Command 03)........................................................................... 37
Figure 16. Read at Higher Speed (FAST_READ) Sequence (Command 0B)....................................................... 38
Figure 17. 2 x I/O Read Mode Sequence (Command BB) .....................................................................................39
Figure 18. 4 x I/O Read Mode Sequence (Command EB) .....................................................................................39
Figure 19. 4 x I/O Read enhance performance Mode Sequence (Command EB) ................................................. 40
Figure 20. Page Program (PP) Sequence (Command 02)....................................................................................41
Figure 21. 4 x I/O Page Program (4PP) Sequence (Command 38) ...................................................................... 41
Figure 22. Continously Program (CP) Mode Sequence with Hardware Detection (Command AD) ....................... 42
Figure 23. Sector Erase (SE) Sequence (Command 20) ......................................................................................42
Figure 24. Block Erase 32KB (BE32K) Sequence (Command 52)........................................................................ 43
Figure 25. Block Erase (BE) Sequence (Command D8) .......................................................................................43
Figure 26. Chip Erase (CE) Sequence (Command 60 or C7) ...............................................................................43
Figure 27. Deep Power-down (DP) Sequence (Command B9)............................................................................. 44
Figure 28. Release from Deep Power-down and Read Electronic Signature (RES) Sequence (Command AB) .. 44
P/N: PM1394
REV. 1.0, MAR. 09, 2009
3
Macronix [ MACRONIX INTERNATIONAL ]
