MMXZ5221B
THRU
MMXZ5259B
M C C
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Features
200 mW
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Planar Die construction
200mW Power Dissipation
Zener Voltages from 2.4V - 39V
Zener Diodes
2.4 to 39 Volts
Ideally Suited for Automated Assembly Processes
Mechanical Data
SOD323
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Case: SOD-323 Molded Plastic
Terminals: Solderable per MIL-STD-202, Method 208
Approx. Weight: 0.008 gram
A
B
Mounting Position: Any
Storage & Operating Junction Temperature: -55oC to +150oC
C
E
Maximum Ratings @ 25oC Unless Otherwise Specified
Zener Current
Maximum Forward
Voltage
IF
VF
100
1.2
mA
V
D
Power Dissipation
(Notes A)
Peak Forward Surge
Current (Notes B)
P(AV)
200
2.0
mWatt
Amps
G
IFSM
NOTES:
DIMENSIONS
MM
A. Mountedon5.0mm2(.013mmthick)landareas.
B. Measured on 8.3ms, single half sine-wave or equivalent
squarewave, dutycycle=4pulsesperminutemaximum.
DIM
INCHES
MIN
NOTE
MAX
.107
.078
.054
.038
.014
.006
---
MIN
2.30
1.75
1.15
0.70
0.25
0.05
0.30
MA X
2.70
1.95
1.35
0.95
0.35
0.15
---
A
B
C
D
E
F
.090
.068
.045
.027
.009
.002
.012
G
SUGGESTED SOLDER
PAD LAYOUT
0.059"
0.039”
0.031”
www.mccsemi.com
MCC [ Micro Commercial Components ]
