MCC
TM
Micro Commercial Components
omponents
20736 Marilla Street Chatsworth
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ES1AE
THRU
ES1ME
1 Amp
Ultra
Fast
Recovery
Silicon Rectifier
50 to 1000 Volts
DO-214AC
(SMAE)
H
Features
•
•
•
•
Lead Free Finish/Rohs Compliant (Note1) ("P"Suffix designates
Compliant. See ordering information)
Epoxy meets UL 94 V-0 flammability rating
Moisture Sensitivity Level 1
High Temp Soldering: 260 C for 10 Seconds At Terminals
Superfast Recovery Times For High Efficiency
Halogen
free available upon request by adding suffix "-HF"
Operating Temperature: -50 C to +150 C
Storage Temperature: -50 C to +150 C
Maximum Thermal Resistance; 15 C/W Junction To Lead
MCC
Part
Number
ES1AE
ES1BE
ES1CE
ES1DE
ES1GE
ES1JE
ES1KE
ES1ME
Device
Marking
ES1A
ES1B
ES1C
ES1D
ES1G
ES1J
ES1K
ES1M
Maximum
Recurrent
Peak Reverse
Voltage
50V
100V
150V
200V
400V
600V
800V
1000V
Maximum
RMS
Voltage
35V
70V
105V
140V
280V
420V
560V
700V
Maximum
DC
Blocking
Voltage
50V
100V
150V
200V
400V
600V
800V
1000V
Maximum Ratings
Cathode Band
J
A
C
Electrical Characteristics @ 25 C Unless Otherwise Specified
Average Forward
I
F(AV)
1.0A
T
J
= 75 C
Current
Peak Forward Surge
I
FSM
30A
8.3ms, half sine
Current
Maximum
Instantaneous
Forward Voltage
V
F
ES1AE-DE
.975V I
FM
= 1.0A;
ES1GE-JE
1.35V
T
J
= 25 C*
ES1KE~ME
1.70V
Maximum DC
I
R
Reverse Current At
5 A
T
J
= 25 C
Rated DC Blocking
100 A T
J
= 100 C
Voltage
Maximum Reverse
Recovery Time
I
F
=0.5A, I
R
=1.0A,
T
rr
50ns
ES1AE-DE
75ns
ES1GE-KE
I
rr
=0.25A
100ns
ES1ME
Typical Junction
C
J
45pF
Measured at
Capacitance
1.0MHz, V
R
=4.0V
*Pulse test: Pulse width 200 sec, Duty cycle 2%
Note:
1.
High Temperature Solder Exemptions Applied, see EU Directive Annex 7.
G
E
D
B
DIMENSIONS
INCHES
MIN
.079
.045
.002
---
.030
.189
.157
.090
MM
MIN
2.01
1.15
.05
---
.76
4.80
4.00
2.29
DIM
A
B
C
D
E
G
H
J
MAX
.096
.071
.008
.02
.060
.208
.180
.115
MAX
2.44
1.80
.20
.51
1.52
5.30
4.57
2.92
NOTE
SUGGESTED SOLDER
PAD LAYOUT
0.090”
0.085”
0.070”
Revision:
C
www.mccsemi.com
1 of 4
2015/10/19
MCC [ Micro Commercial Components ]
