1.2.4 Case outline(s). The case outline(s) shall be as designated in MIL-STD-1835 and as follows:
Outline letter
Descriptive designator
GDIP1-T32 or CDIP2-T32
CQCC1-N44
Terminals
Package style
Dual in-line
Square chip carrier
Flat package
Rectangular chip carrier
Grid array
X
Y
Z
U
T
W
M
N
6
32
44
32
32
30
36
32
32
32
32
See figure 1
CQCC1-N32
See figure 1
See figure 1
See figure 1
See figure 1
Grid array
Flat package
Flat package
Flat package
Flat package
See figure 1(enhanced rad tolerant)
See figure 1(enhanced rad tolerant)
7
1.2.5 Lead finish. The lead finish is as specified in MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535, appendix
A for device class M.
1.3 Absolute maximum ratings. 1/ 2/
Supply voltage range (V ) . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5 V dc to +6.0 V dc 3/
CC
Operating case temperature range . . . . . . . . . . . . . . . . . . . . . . -55 C to +125 C
Storage temperature range . . . . . . . . . . . . . . . . . . . . . . . . . . . . -65 C to +150 C
Lead temperature (soldering, 10 seconds) . . . . . . . . . . . . . . . . +300 C
Thermal resistance, junction-to-case (
):
JC
Cases X, Y and U . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . See MIL-STD-1835
Cases T and W . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 C/W 4/
Case Z . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 C/W 4/
Case M . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 C/W 4/
Case N . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 C/W 4/
Case 6 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.5 C/W 4/
Case 7 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.5 C/W 4/
Maximum power dissipation (P ) . . . . . . . . . . . . . . . . . . . . . . . . 1.0 watts
D
Junction temperature (T ) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +175 C 5/
J
Endurance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10,000 cycles/byte (minimum)
Data retention . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 years minimum
1.4 Recommended operating conditions.
Supply voltage range (V ) . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4.5 V dc minimum to 5.5 V dc maximum
CC
Supply voltage (V
)
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0.0 V dc
SS
High level input voltage range (V ) . . . . . . . . . . . . . . . . . . . . . . 2.0 V dc to V
+ 1.0 V dc 6/
CC
IH
Low level input voltage range (V ) . . . . . . . . . . . . . . . . . . . . . . -0.1 V dc to 0.8 V dc
IL
Case operating temperature range (T ) . . . . . . . . . . . . . . . . . . -55 C to +125 C
C
1.5 Digital logic testing for device classes Q and V.
Fault coverage measurement of manufacturing
logic tests (MIL-STD-883, test method 5012) . . . . . . . . . . . . . . 100 percent
1/ Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at the
maximum levels may degrade performance and affect reliability.
2/ All voltages referenced to V
(V = ground), unless otherwise specified.
SS SS
3/ Negative undershoots to a minimum of -1.0 V are allowed with a maximum of 20 ns pulse width.
4/ When the thermal resistance for this case is specified in MIL-STD-1835, that value shall supersede
the value indicated herein.
5/ Maximum junction temperature shall not be exceeded except for allowable short duration burn-in screening
conditions in accordance with method 5004 of MIL-STD-883.
6/ For device types 16-19 only, V on RES shall be V
- 0.5 V min. to V
+ 1.0 V max.
IH
CC
CC
SIZE
STANDARD
MICROCIRCUIT DRAWING
5962-38267
A
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
REVISION LEVEL
G
SHEET
3
DSCC FORM 2234
APR 97
MAXWELL [ MAXWELL TECHNOLOGIES ]
