Maxim Product Naming Conventions - Maxim
H
J
K
L
L
L
M
N
P
Q
R
S
T
T
T
TSSOP (Thin Shrink Small Outline Package) 4.4mm (8 leads)
CERDIP (Ceramic Dual-Inline) (N) 300 mil (8, 14, 16, 18, 20 leads); (W) 600 mil
(24, 28, 40 leads)
SOT 1.23mm (8 Leads)
LCC (Leadless Ceramic Chip Carrier) (18, 20, 28 leads)
FCLGA (Flip Chip Land Grid Array); THIN LGA (Thin Land Grid Array) 0.8mm
µDFN (Micro Dual Flat No Lead) (6, 8, 10 leads)
MQFP (Metric Quad Flat Pack) over 1.4mm; ED-QUAD (28mm x 28mm 160
leads)
PDIP (Narrow Plastic Dual-Inline) 300 mil (24, 28 leads)
PDIP (Plastic Dual-Inline) 300 mil (8, 14, 16, 18, 20 leads); 600 mil (24, 28, 40
leads)
PLCC (Plastic Leaded Chip Carrier)
CERDIP (Narrow Ceramic Dual-Inline) 300 mil (24, 28 leads)
SOIC (Narrow Plastic Small Outline) 150 mil
METAL CAN (Nickel)
TDFN (Plastic, Very Very Thin, Dual Flat No Lead - Sawn Version) 0.9mm (6, 8,
10, 14 leads)
THIN QFN (Plastic, Very Very Thin, Quad Flat No Lead - Sawn Version) 0.8mm
TQ THIN QFN (Plastic, Very Very Thin, Quad Flat No Lead - Sawn Version) 0.8mm
(8 leads)
U
U
U
V
W
W
X
X
SOT 1.23mm (3, 4, 5, 6 leads)
TSSOP (Thin Shrink Small Outline Package) 4.4mm (14, 16, 20, 24, 28, 38, 56
leads); 6.1mm (48 leads)
µMAX (Thin Shrink Small Outline Package) 3mm x 3mm (8, 10 leads)
U. TQFN (Ultra Thin QFN -Plastic Ultra Thin Quad Flat No Lead - Sawn version)
0.55mm
SOIC (Wide Plastic Small Outline) 300 mil
WLP (Wafer Level Pkg)
CSBGA 1.4mm
CVBGA 1.0mm
https://www.maximintegrated.com/en/design/packaging/package-i... 4/14/2016
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