5V/3.3V or Adjustable, Low-Dropout,
Low I
Q
, 200mA Linear Regulators
MAX882/MAX883/MAX884
1.6
1.5
POWER DISSIPATION (W)
1.4
1.3
1.2
1.1
1.0
0.9
0.1cm
2
0.0155in
2
MAX882/4-fig04
MAXIMUM OUTPUT CURRENT (mA)
150
HIGH-
POWER
SOIC
PLASTIC DIP
CERAMIC DIP
100
50
1cm
2
0.155in
2
10cm
2
1.55in
2
100cm
2
15.5in
2
0
2
3
4
OPERATING
REGION AT
T
A
= +25°C
T
J
= +125°C
5 6
7
8
9 10 11 12 13
SUPPLY VOLTAGE (V)
COPPER GROUND PAD AREA
Figure 4. Typical Maximum Power Dissipation vs. Ground
Pad Area
Figure 5a. Safe Operating Regions: MAX882/MAX884 Maximum
Output Current vs. Supply Voltage
MAXIMUM OUTPUT CURRENT (mA)
TYPICAL DROPOUT VOLTAGE LIMIT
Figure 4 assumes the IC is in an 8-pin small-outline pack-
age that has a maximum junction temperature of +125°C
and is soldered directly to the pad; it also has a +25°C
ambient air temperature and no other heat sources. Use
larger pad sizes for other packages, lower junction tem-
peratures, higher ambient temperatures, or conditions
where the IC is not soldered directly to the heat-sinking
ground pad. When operating C and E grade parts up to a
T
J
of +125°C, expect performance similar to M grade
specifications. For T
J
between +125°C and +150°C, the
output voltage may drift more.
The MAX882/MAX883/MAX884 can regulate currents up
to 250mA and operate with input voltages up to 11.5V, but
not simultaneously. High output currents can only be sus-
tained when input-output differential voltages are small, as
shown in Figure 5. Maximum power dissipation depends
on packaging, temperature, and air flow. The maximum
output current is as follows:
I
OUT(MAX)
=
P(T
J
−
T
A
)
(V
IN
−
V
OUT
)100
°
C
150
HIGH-
POWER
SOIC
PLASTIC DIP
100
CERAMIC DIP
50
OPERATING
REGION AT
T
A
= +25°C
T
J
= +125°C
5
6
7
8
9
10
11 12
0
4
13
SUPPLY VOLTAGE (V)
Figure 5b. Safe Operating Regions: MAX883 Maximum Output
Current vs. Supply Voltage
where P is derived from Figure 4.
10
______________________________________________________________________________________
MAXIMUM SUPPLY VOLTAGE LIMIT
The GND pins of the MAX882/MAX883/MAX884 SOIC
package perform the dual function of providing an elect-
rical connection to ground and channeling heat away. Con-
nect all GND pins to ground using a large pad or ground
plane. Where this is impossible, place a copper plane on an
adjacent layer. For a given power dissipation, the pad
should exceed the associated dimensions in Figure 4.
MAXIMUM CURRENT
200
MAXIMUM POWER
DISSIPATION LIMIT
MAX882/4-05b
250
MAXIMUM SUPPLY VOLTAGE LIMIT
TYPICAL DROPOUT VOLTAGE LIMIT
MAX883, V
OUT
= 5V
8-PIN SO PACKAGE
77.4cm
2
,
SINGLE-SIDED BOARD
1oz. COPPER
GLASS EPOXY,
T
J
= +125°C,
T
A
= +25°C, STILL AIR
MAXIMUM CURRENT
200
MAXIMUM POWER
DISSIPATION LIMIT
MAX882/4-05a
250
MAXIM [ MAXIM INTEGRATED PRODUCTS ]
