Overvoltage Protection Controllers
with Reverse Polarity Protection
5L/MAX4867
R
C
R
D
1MΩ
1.5kΩ
I
100%
90%
PEAK-TO-PEAK RINGING
(NOT DRAWN TO SCALE)
I
P
r
DISCHARGE
RESISTANCE
CHARGE-CURRENT
LIMIT RESISTOR
AMPERES
HIGH-
VOLTAGE
DC
DEVICE
UNDER
TEST
36.8%
C
s
100pF
STORAGE
CAPACITOR
10%
0
SOURCE
TIME
0
t
RI
t
DL
CURRENT WAVEFORM
Figure 7. Human Body ESꢀ Test Model
Figure 8. Human Body Current Waveform
R
C
R
D
I
50MΩ TO 100MΩ
330Ω
100%
90%
DISCHARGE
RESISTANCE
CHARGE-CURRENT
LIMIT RESISTOR
HIGH-
VOLTAGE
DC
DEVICE
UNDER
TEST
C
150pF
STORAGE
CAPACITOR
s
SOURCE
10%
t = 0.7ns TO 1ns
R
t
30ns
60ns
Figure 9. IEC ±000-4-2 ESꢀ Test Model
Figure ±0. IEC ±000-4-2 ESꢀ Generator Current Waveform
erally lower than that measured using the Human Body
Model. Figure ±0 shows the current waveform for the
±8kV IEC ±000-4-2 Level 4 ESꢀ Contact ꢀischarge test.
The Air-Gap test involves approaching the device with a
charger probe. The Contact ꢀischarge method connects
the probe to the device before the probe is energized.
IEC 1000-4-2
Since January ±996, all equipment manufactured
and/or sold in the European Union has been required to
meet the stringent IEC ±000-4-2 specification. The IEC
±000-4-2 standard covers ESꢀ testing and perfor-
mance of finished equipment. It does not specifically
refer to ICs. The MAX4864L/MAX4865L/MAX4866L/
MAX4867 help users design equipment that meets
Level 3 of IEC ±000-4-2, without additional ESꢀ-protec-
tion components.
Chip Information
PROCESS: BiCMOS
The main difference between tests done using the
Human Body Model and IEC ±000-4-2 is higher peak
current in IEC ±000-4-2. Because series resistance is
lower in the IEC ±000-4-2 ESꢀ test model (Figure 9), the
ESꢀ-withstand voltage measured to this standard is gen-
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9
MAXIM [ MAXIM INTEGRATED PRODUCTS ]
