Overvoltage Protection Controllers
with Reverse Polarity Protection
MAX4864L/MAX4865L/MAX4866L/MAX4867
R
C
1MΩ
CHARGE-CURRENT
LIMIT RESISTOR
HIGH-
VOLTAGE
DC
SOURCE
R
D
1.5Ω
DISCHARGE
RESISTANCE
DEVICE
UNDER
TEST
I
P
100%
90%
AMPERES
Cs
100pF
STORAGE
CAPACITOR
36.8%
10%
0
0
t
RI
TIME
t
DL
CURRENT WAVEFORM
Ir
PEAK-TO-PEAK RINGING
(NOT DRAWN TO SCALE)
Figure 7. Human Body ESD Test Model
Figure 8. Human Body Current Waveform
R
C
50Ω TO 100Ω
CHARGE-CURRENT
LIMIT RESISTOR
HIGH-
VOLTAGE
DC
SOURCE
R
D
330Ω
DISCHARGE
RESISTANCE
DEVICE
UNDER
TEST
I
100%
90%
I
PEAK
Cs
150pF
STORAGE
CAPACITOR
10%
t
R
= 0.7ns TO 1ns
30ns
60ns
t
Figure 9. IEC 1000-4-2 ESD Test Model
Figure 10. IEC 1000-4-2 ESD Generator Current Waveform
IEC 1000-4-2
Since January 1996, all equipment manufactured
and/or sold in the European Union has been required to
meet the stringent IEC 1000-4-2 specification. The IEC
1000-4-2 standard covers ESD testing and perfor-
mance of finished equipment. It does not specifically
refer to ICs. The MAX4864L/MAX4865L/MAX4866L/
MAX4867 help users design equipment that meets
Level 3 of IEC 1000-4-2, without additional ESD-protec-
tion components.
The main difference between tests done using the
Human Body Model and IEC 1000-4-2 is higher peak
current in IEC 1000-4-2. Because series resistance is
lower in the IEC 1000-4-2 ESD test model (Figure
9),
the
ESD-withstand voltage measured to this standard is gen-
erally lower than that measured using the Human Body
Model.
Figure 10
shows the current waveform for the
±8kV IEC 1000-4-2 Level 4 ESD Contact Discharge test.
The Air-Gap test involves approaching the device with a
charger probe. The Contact Discharge method connects
the probe to the device before the probe is energized.
Chip Information
TRANSISTOR COUNT: 727
PROCESS TECHNOLOGY: BiCMOS
8
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