±1 5 k V ES D-P ro t e c t e d , S le w -Ra t e -Lim it e d ,
Lo w -P o w e r, RS -4 8 5 /RS -4 2 2 Tra n s c e ive rs
10dB/div
10dB/div
0Hz
5MHz
0Hz
5MHz
500kHz/div
500kHz/div
Figure 16. Driver Output Waveform and FFT Plot of
Figure 17. Driver Output Waveform and FFT Plot of
MAX485E/MAX490E/MAX491E/MAX1487E Transmitting a
150kHz Signal
MAX483E/MAX487E–MAX489E Transmitting a 150kHz Signal
The major difference between tests done using the
Human Body Model and IEC1000-4-2 is higher peak
current in IEC1000-4-2, because series resistance is
lower in the IEC1000-4-2 model. Hence, the ESD with-
stand voltage measured to IEC1000-4-2 is generally
lowe r tha n tha t me a s ure d us ing the Huma n Bod y
Model. Figure 7 shows the current waveform for the 8kV
IEC1000-4-2 ESD contact-discharge test.
MAX4 8 3 E/MAX4 8 7 E/MAX4 8 8 E/MAX4 8 9 E:
Re d u c e d EMI a n d Re fle c t io n s
The MAX483E and MAX487E–MAX489E are slew-rate
limite d , minimizing EMI a nd re d uc ing re fle c tions
caused by improperly terminated cables. Figure 16
shows the driver output waveform and its Fourier analy-
s is of a 150kHz s ig na l tra ns mitte d b y a MAX481E,
MAX485E, MAX490E, MAX491E, or MAX1487E. High-
frequency harmonics with large amplitudes are evident.
Figure 17 shows the same information displayed for a
MAX483E, MAX487E, MAX488E, or MAX489E transmit-
ting under the same conditions. Figure 17’s high-fre-
quency harmonics have much lower amplitudes, and
the potential for EMI is significantly reduced.
The air-gap test involves approaching the device with a
charged probe. The contact-discharge method connects
the probe to the device before the probe is energized.
Machine Model
The Ma c hine Mod e l for ESD te s ts a ll p ins us ing a
200pF storage capacitor and zero discharge resis -
tance. Its objective is to emulate the stress caused by
contact that occurs with handling and assembly during
manufacturing. Of course, all pins require this protec-
tion during manufacturing—not just inputs and outputs.
Therefore, after PC board assembly, the Machine Model
is less relevant to I/O ports.
Lo w -P o w e r S h u t d o w n Mo d e
(MAX4 8 1 E/MAX4 8 3 E/MAX4 8 7 E)
A low-power shutdown mode is initiated by bringing
both RE high and DE low. The devices will not shut
down unless both the driver and receiver are disabled.
In shutdown, the devices typically draw only 0.5µA of
supply current.
MAX4 8 7 E/MAX1 4 8 7 E:
1 2 8 Tra n s c e ive rs o n t h e Bu s
RE and DE may be driven simultaneously; the parts are
guaranteed not to enter shutdown if RE is high and DE
is low for less than 50ns. If the inputs are in this state
for at least 600ns, the parts are guaranteed to enter
shutdown.
The 48kΩ, 1/4-unit-load receiver input impedance of the
MAX487E and MAX1487E allows up to 128 transceivers
on a bus, compared to the 1-unit load (12kΩ input
impedance) of standard RS-485 drivers (32 transceivers
maximum). Any combination of MAX487E/MAX1487E
and other RS-485 transceivers with a total of 32 unit
loads or less can be put on the bus. The MAX481E,
MAX483E, MAX485E, and MAX488E–MAX491E have
standard 12kΩ receiver input impedance.
For the MAX481E, MAX483E, and MAX487E, the t
ZH
and t enable times assume the part was not in the
ZL
low-power shutdown state (the MAX485E, MAX488E–
MAX491E, and MAX1487E can not be shut down). The
t
a nd t
e na b le time s a s s ume the
ZH(SHDN)
ZL(SHDN)
35–9/MAX1487E
parts were shut down (see Electrical Characteristics).
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