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MAX44246 参数 Datasheet PDF下载

MAX44246图片预览
型号: MAX44246
PDF下载: 下载PDF文件 查看货源
内容描述: 36V ,低噪声,高精度,双通道运算放大器 [36V, Low-Noise, Precision, Dual Op Amp]
分类和应用: 运算放大器
文件页数/大小: 12 页 / 2377 K
品牌: MAXIM [ MAXIM INTEGRATED PRODUCTS ]
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MAX44246  
36V, Low-Noise, Precision, Dual Op Amp  
The MAX11211 ADC operates from a single 2.7V to 3.6V  
analog supply, offers 1ꢁ-bit noise-free resolution and  
ꢂ.ꢁ6mW power dissipation. The MAX11211 also offers  
> 1ꢂꢂdB rejection at ꢀꢂHz and 6ꢂHz. This ADC is part of  
a family of 16-, 1ꢁ-, 2ꢂ-, and 24-bit delta sigma ADCs with  
high precision and < 1mW power dissipation.  
V
SUPPLY  
I
LOAD  
MAX44246  
OUT  
The low input offset voltage and low noise of MAX44246  
allows a gain circuit to precede the MAX11211 without  
losing any dynamic range at the ADC. See the Typical  
Operating Circuit.  
R
SENSE  
R2  
R1  
Precision Low-Side Current Sensing  
The ICs’ ultra-low offset voltage and drift make them  
ideal for precision current-sensing applications. Figure 1  
shows the ICs in a low-side current-sense configuration.  
This circuit produces an accurate output voltage, V  
OUT  
Figure 1. Low-Side Current Sensing  
equal to I  
x R x (1 + R /R ).  
SENSE 2 1  
LOAD  
the amplifier away from potential heat sources on the  
board, if possible. Orient the resistors such that both  
the ends are heated equally. It is a good practice to  
match the input signal path to ensure that the type and  
number of thermoelectric junctions remain the same. For  
example, consider using dummy ꢂΩ resistors oriented  
in such a way that the thermoelectric sources, due to  
the real resistors in the signal path, are cancelled. It is  
recommended to flood the PCB with ground plane. The  
ground plane ensures that heat is distributed uniformly  
reducing the potential offset voltage degradation due to  
Seebeck effect.  
Layout Guidelines  
The MAX44246 features ultra-low offset voltage and  
noise. Therefore, to get optimum performance follow the  
following layout guidelines.  
Avoid temperature gradients at the junction of two dis-  
similar metals. The most common dissimilar metals used  
on a PCB are solder-to-component lead and solder-to-  
board trace. Dissimilar metals create a local thermo-  
couple. A variation in temperature across the board can  
cause an additional offset due to Seebeck effect at the  
solder junctions. To minimize the Seebeck effect, place  
Maxim Integrated  
10  
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