±±15k EꢀDꢁ-rotected, ±µA, ±6Mbps, Dual/Quad
Lowꢁkoltage Level Translators in UCꢀ-
Chip Information
TRANSISTOR COUNT: MAX3372E–MAX3376E: 189
MAX3377E–MAX3379E,
MAX3390E–MAX3393E: 295
PROCESS: BiCMOS
-ac5age Information
(The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline information
go to www.maxim-ic.com/packages.)
SEE DETAIL "A"
SYMBOL
MIN
MAX
e
b
A
0.90
0.00
0.90
0.28
0.09
2.80
2.60
1.50
0.30
1.45
0.15
1.30
0.45
0.20
3.00
3.00
1.75
0.60
C
L
A1
A2
b
C
D
E
C
C
L
E1
L
E
E1
L
0.25 BSC.
L2
e
PIN 1
I.D. DOT
(SEE NOTE 6)
0.65 BSC.
1.95 REF.
e1
0
0
8
e1
D
C
C
L
L2
A2
A
GAUGE PLANE
A1
SEATING PLANE
C
0
L
NOTE:
1. ALL DIMENSIONS ARE IN MILLIMETERS.
2. FOOT LENGTH MEASURED FROM LEAD TIP TO UPPER RADIUS OF
HEEL OF THE LEAD PARALLEL TO SEATING PLANE C.
DETAIL "A"
3. PACKAGE OUTLINE EXCLUSIVE OF MOLD FLASH & METAL BURR.
4. PACKAGE OUTLINE INCLUSIVE OF SOLDER PLATING.
5. COPLANARITY 4 MILS. MAX.
6. PIN 1 I.D. DOT IS 0.3 MM MIN. LOCATED ABOVE PIN 1.
PROPRIETARY INFORMATION
TITLE:
7. SOLDER THICKNESS MEASURED AT FLAT SECTION OF LEAD
BETWEEN 0.08mm AND 0.15mm FROM LEAD TIP.
8. MEETS JEDEC MO178.
PACKAGE OUTLINE, SOT-23, 8L BODY
APPROVAL
DOCUMENT CONTROL NO.
REV.
1
21-0078
D
1
24 ______________________________________________________________________________________
MAXIM [ MAXIM INTEGRATED PRODUCTS ]
