Low-Cost, Multichemistry Battery-
Charger Building Block
MAX1772
ABSOLUTE MAXIMUM RATINGS
DCIN, CSSP, CSSN to GND ...................................-0.3V to +30V
BST to GND ............................................................-0.3V to +36V
BST to LX..................................................................-0.3V to +6V
DHI to LX ...................................................-0.3V to (V
BST
+ 0.3V)
LX to GND .................................................................-6V to +30V
BATT, CSIP, CSIN to GND........................................-0.3V to 20V
CSIP to CSIN or CSSP to CSSN or
PGND to GND ...........……….……………..…….-0.3V to +0.3V
CCI, CCS, CCV, DLO, ICHG, IINP,
ACIN, REF to GND ...............................-0.3V to (V
LDO
+ 0.3V)
DLOV, VCTL, ICTL, REFIN, CELLS,
CLS, LDO, ACOK to GND ....................................-0.3V to +6V
DLOV to LDO.........................................................-0.3V to +0.3V
DLO to PGND .........................................-0.3V to (V
DLOV
+ 0.3V)
LDO Short-Circuit Current ..................................................50mA
Continuous Power Dissipation (T
A
= +70°C)
28-Pin QSOP (derate 12.6mW/°C above +70°C).......1008mW
Junction-to-Ambient Thermal Resistance (θ
JA
)
(Note 1) .....................................................................79.3°C/W
Junction-to-Case Thermal Resistance (
θ
JC
)
(Note 1) ........................................................................27°C/W
Operating Temperature Range ...........................-40°C to +85°C
Junction Temperature ........................................................150°C
Storage Temperature Range .............................-60°C to +150°C
Lead Temperature (soldering, 10s) .................................+300°C
Note 1:
Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer
board. For detailed information on package thermal considerations, refer to
www.maxim-ic.com/thermal-tutorial
.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
ELECTRICAL CHARACTERISTICS
(V
DCIN
= V
CSSP
= V
CSSN
= 18V, V
BATT
= V
CSIP
= V
CSIN
= 12V, V
REFIN
= 3.0V, V
VCTL
= V
ICTL
= 0.75
V
REFIN
, V
CELLS
= 2.0V,
V
ACIN
= 0V, CLS = REF, V
BST
- V
LX
= 4.5V, V
GND
= V
PGND
= 0V, C
LDO
= 1µF, LDO = DLOV, C
REF
= 1µF; pins CCI, CCS, and CCV
are compensated per Figure 1a;
T
A
= 0°C to +85°C,
unless otherwise noted. Typical values are at T
A
= +25°C.)
PARAMETER
SYMBOL
CONDITIONS
MIN
8
V
DCIN
falling
V
DCIN
rising
I
DCIN
8.0V < V
DCIN
< 28V
8.0V < V
DCIN
< 28V, no load
0 < I
LDO
< 10mA
V
DCIN
= 8.0V
0 < I
REF
< 500µA
V
REF
falling
3.20
4.072
5.25
7.0
7.4
7.5
2.7
5.40
34
4.00
4.096
3.1
7.85
6.0
5.55
100
5.15
4.120
3.9
TYP
MAX
28
UNITS
V
V
mA
V
mV
V
V
V
SUPPLY AND LDO REGULATOR
V
DCIN
DCIN Input Voltage Range
DCIN Undervoltage Lockout
Trip Point
DCIN Quiescent Current
LDO Output Voltage
LDO Load Regulation
LDO Undervoltage Lockout
Trip Point
REF Output Voltage
REF Undervoltage Lockout
Trip Point
TRIP POINTS
BATT POWER_FAIL Threshold
BATT POWER_FAIL Threshold
Hysteresis
ACIN Threshold
ACIN Threshold Hysteresis
ACIN Input Bias Current
CLS Input Range
CLS Input Bias Current
SWITCHING REGULATOR
Minimum Off-Time
V
BATT
=16.8V
V
CLS
= 2.0V
V
ACIN
rising
0.5% of V
REF
V
ACIN
= 2.048V
V
CSSP
falling
50
100
2.007
10
-1
1.6
-1
1.00
100
200
2.048
20
150
300
2.089
30
+1
REF
+1
mV
mV
V
mV
µA
V
µA
µs
1.25
1.50
2
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