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71M6113-ILR 参数 Datasheet PDF下载

71M6113-ILR图片预览
型号: 71M6113-ILR
PDF下载: 下载PDF文件 查看货源
内容描述: 片上温度传感器使局部温度数字片上电源监控 [On-Chip Temperature Sensor Enables Localized Digital Temperature On-Chip Power Monitoring]
分类和应用: 传感器温度传感器监控
文件页数/大小: 19 页 / 374 K
品牌: MAXIM [ MAXIM INTEGRATED PRODUCTS ]
 浏览型号71M6113-ILR的Datasheet PDF文件第5页浏览型号71M6113-ILR的Datasheet PDF文件第6页浏览型号71M6113-ILR的Datasheet PDF文件第7页浏览型号71M6113-ILR的Datasheet PDF文件第8页浏览型号71M6113-ILR的Datasheet PDF文件第10页浏览型号71M6113-ILR的Datasheet PDF文件第11页浏览型号71M6113-ILR的Datasheet PDF文件第12页浏览型号71M6113-ILR的Datasheet PDF文件第13页  
PDS_6xxx_010  
71M6xxx Data Sheet  
Shunt Current Sensors  
C
NEUTRAL  
B
LOAD  
A
POWER SUPPLY  
NEUTRAL  
Note: This system is referenced to Neutral  
3x TERIDIAN  
71M6xx3  
MUX and ADC  
V3P3A V3P3SYS  
GNDA GNDD  
Pulse Transformers  
IADC0  
IADC1  
}
IN*  
PWR MODE  
CONTROL  
VADC10 (VC)  
IADC6  
TERIDIAN  
71M6543F/  
71M6543H  
}IC  
WAKE-UP  
IADC7  
REGULATOR  
VADC9 (VB)  
IADC4  
BATTERY  
}
IB  
VBAT  
IADC5  
VBAT_RTC  
VADC8 (VA)  
IADC2  
IADC3  
RTC  
BATTERY  
BATTERY  
MONITOR  
TEMPERATURE  
SENSOR  
}
IA  
VREF  
RAM  
COM0...5  
SEG  
LCD DISPLAY  
SERIAL PORTS  
COMPUTE  
ENGINE  
8888.8888  
TX  
RX  
SEG/DIO  
AMR  
IR  
LCD DRIVER  
DIO, PULSES  
FLASH  
MEMORY  
PULSES,  
DIO  
DIO  
MODUL-  
RX  
ATOR  
TX  
I2C or µWire  
EEPROM  
POWER FAULT  
COMPARATOR  
MPU  
RTC  
V3P3D  
OSCILLATOR/  
PLL  
TIMERS  
XIN  
SPI INTERFACE  
32 kHz  
HOST  
ICE  
XOUT  
*IN = Neutral Current  
9/17/2010  
Figure 4: Current Sensors Connected to the 71M6543F/H or 71M6545/H with Three 71M6xx3  
3.4  
PCB Layout Considerations  
To limit emissions and susceptibility to electromagnetic and magnetic fields, the signal wiring between the  
shunt resistors and the 71M6xxx should be as short as possible and should consist of tightly twisted pair  
cable. Similarly, the PCB traces between the 71M6xxx and the 71M654x should be routed as short as  
possible and should be surrounded by grounded copper structures. The trace pairs should be routed as  
close to each other as permitted by the PCB manufacturer.  
The copper separation (gap) between the shunt side and the 71M654x side of the signal transformer  
should be as wide as permitted by the footprint of the transformer, as shown in Figure 5.  
v1.2  
© 2008–2011 Teridian Semiconductor Corporation  
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