PDS_6xxx_010
71M6xxx Data Sheet
4.6
Package Outline Drawing
Controlling dimensions are in mm.
10
9
2.465
PARTING
LINE
5°
+3°
-5°
5.99
+0.21
-0.05
1.97
COO
0.64
5
+0.25
-0.23
DETAIL A
BOTTOM VIEW
TOP VIEW
0.41
+0.08
-0.06
SEE
DETAIL A
1.27 BSC
0.33
±0.08
x 45°
1.47
+0.08
-0.07
8
1.63 +0.10 -0.08
3
4.93 -0.13
3.94
+0.05
-0.13
4
0.20
+0.05
-0.01
+0.05
0.15
4
SEATING
PLANE
+0.1 -
0.023
SIDE VIEW
NOTES:
END VIEW
3
4
REFERENCE DATUM
LENGTH AND WIDTH ARE REFERENCE DATUMS AND DO NOT
INCLUDE MOLD FLASH OR PROTRUSIONS, BUT INCLUDE MOLD
MISMATCH. MEASURED AT THE MOLD PARTING LINE.
PROTRUSIONS DO NOT EXCEED 0.1524 mm AT END AND 0.254
mm AT WINDOW.
5
8
LENGTH OF TERMINAL FOR SOLDERING TO SUBSTRATE
FORMED LEADS ARE PLANAR WITH RESPECT TO EACH OTHER
WITHIN 0.735 mm AT SEATING PLANE.
9
THE APPEARANCE OF PIN #1 I.D. IS OPTIONAL.
COUNTRY OF ORIGIN LOCATION ON PACKAGE BOTTOM IS
OPTIONAL AND DEPENDS ON ASSEMBLY LOCATION.
10
PACKAGE IS COMPLIANT WITH JEDEC STANDARD MS-012.
DIMENSIONING AND TOLERANCES PER ANSI Y14.5 M - 1982
Figure 8: SOIC-8 Package Outline
v1.2
© 2008–2011 Teridian Semiconductor Corporation
16
MAXIM [ MAXIM INTEGRATED PRODUCTS ]
