DA9285.004
13 July 2006
SOLDERING INFORMATION (QFN-6)
N For Lead-Free / RoHS Compliant Green QFN 2mm x 2mm x 0.75mm
Resistance to Soldering Heat
Maximum Temperature
Maximum Number of Reflow Cycles
Reflow profile
According to RSH test IEC 68-2-58/20
260°C
3
Thermal profile parameters stated in IPC/JEDEC J-STD-020
should not be exceeded. http://www.jedec.org
7.62 - 25.4 µm, Matte Tin
Lead Finish
EMBOSSED TAPE SPECIFICATIONS (QFN-6)
DO
P
O
T
P
2
P1
X
E
10OMAX
W
F
B
0
X
K
0
A0
User Direction of Feed
Detail X-X
Dimension
Min/Max
Unit
Ao
Bo
Do
E
mm
mm
mm
mm
mm
mm
mm
mm
mm
mm
mm
2.30 ±0.05
2.30 ±0.05
1.50 +0.1/-0.0
1.75 ±0.10
3.50 ±0.05
1.00 ±0.05
4.0
F
Ko
Po
P1
P2
T
4.0
2.0
0.254
±0.10
±0.05
±0.02
W
8.00 ±0.3/-0.1
9 (11)
MAS [ MICRO ANALOG SYSTEMS ]
