DA9283.006
13 July 2006
PIN DESCRIPTION
Pin Description
Crystal Oscillator Output
Voltage Control Input
Power Supply Ground
Crystal/Varactor Oscillator Input
Output Buffer Power Down Control
Power Supply Voltage
Buffer Output
Symbol
X2
VC
V
SS
X1
PD
V
DD
OUT
x-coordinate
186
372
543
149
330
500
919
y-coordinate
142
142
142
920
920
920
920
Note:
Because the substrate of the die is internally connected to GND, the die has to be connected to GND or
left floating. Please make sure that GND is the first pad to be bonded. Pick-and-place and all component
assembly are recommended to be performed in ESD protected area.
Note:
Pad coordinates are measured from the left bottom corner of the chip to the center of the pads. The
coordinates may vary depending on sawing width and location. However, the distances between pads are
accurate.
ABSOLUTE MAXIMUM RATINGS
Parameter
Supply Voltage
Input Pin Voltage
Power Dissipation (max)
Storage Temperature
ESD Rating
Symbol
V
DD
- V
SS
P
MAX
T
ST
HBM
Conditions
Min
-0.3
V
SS
-0.3
-55
Max
5.5
V
DD
+ 0.3
100
150
2
Unit
V
V
mW
o
C
kV
Note
RECOMMENDED OPERATION CONDITIONS
Parameter
Supply Voltage
Symbol
V
DD
I
DD
T
OP
Z
VC,LINE
S
C
L
Conditions
For 3.3 V / 5.0 V
versions
For 3.3 V versions
V
DD
= 2.8 V
Min
2.5
2.5
-40
1
30
10
Typ
3.3
3.3
3.2
Max
5.3
4.0
+85
mA
o
C
M
ppm/pF
pF
Unit
V
Note
1)
1, 2)
3)
Supply Current
Operating Temperature
Voltage Control Line
Impedance
Crystal Pulling Sensitivity
Crystal Load Capacitance
V
C
= 1.65 V
4)
Note 1:
It is recommended to connect a 1 nF capacitor between the V
DD
and V
SS
pins.
Note 2:
For 3.3 V versions MAS9283AA-AE, MAS9283AN-AR.
Note 3:
Value at 15MHz. At 40MHz I
DD
is typically 5.8 mA.
Note 4:
MAS9283AG – AL has a typical crystal load capacitance of 8.5 pF when V
C
= 2.5 V. MAS9283AT – AX
has a typical crystal load capacitance of 9 pF when V
C
= 2.5 V.
2 (14)
MAS [ MICRO ANALOG SYSTEMS ]
