DA9280.003
13 July 2006
PIN DESCRIPTION
Pin Description
Symbol
MAS9280A1/
A3 /B1/B3
x-coordinate
268
604
1047
1420
1848
1048
268
796
2020
1701
2058
MAS9280A1/
A3 /B1/B3
y-coordinate
1320
1320
1320
1320
1320
164
164
164
164
164
1320
MAS9280A2
/B2
x-coordinate
268
604
1420
1047
1848
1048
268
796
2020
1701
2058
MAS9280A2
/B2
y-coordinate
1320
1320
1320
1320
1320
164
164
164
164
164
1320
Power Supply Voltage
Programming Input
Serial Bus Clock Input
Serial Bus Data Input
Temperature Output
Crystal/Varactor Oscillator Input
Voltage Control Input
Crystal Oscillator Output
Buffer Output
Power Supply Ground
Test Multiplexer Output
VDD
PV
CLK
DA
TE1
X2
VC
X1
OUT
VSS
TE2
Note:
Because the substrate of the die is internally connected to GND, the die has to be connected to GND or
left floating. Please make sure that GND is the first pad to be bonded. Pick-and-place and all component
assembly are recommended to be performed in ESD protected area.
Note:
Pad coordinates are measured from the left bottom corner of the chip to the center of the pads. The
coordinates may vary depending on sawing width and location, however, distances between pads are accurate.
Note:
Test Multiplexer Output is for testing only and must not be connected in module.
ABSOLUTE MAXIMUM RATINGS
Parameter
Supply Voltage
Input Voltage
Power Dissipation
Storage Temperature
Note 1:
Not valid for programming pin PV
Symbol
V
DD
- V
SS
V
IN
P
MAX
T
ST
Min
-0.3
V
SS
-0.3
-55
Max
6.0
V
DD
+ 0.3
20
150
Unit
V
V
mW
o
C
Note
1)
RECOMMENDED OPERATION CONDITIONS
Parameter
Supply Voltage
Supply Current
Operating Temperature
Load Capacitance
Load Capacitance
Crystal Pulling Sensitivity
Crystal Rs
Symbol
V
DD
I
CC
T
OP
C
L
C
L
S
C
RS
Conditions
Vdd = 2.8 Volt
-40
8
10
18
30
50
Min
2.4
Typ
2.6
Max
5.0
1.8
+85
Unit
V
mA
o
C
pF
pF
ppm/pF
Note
1
2
3
Note 1:
MAS9280A1, MAS9280A2 and MAS9280A3 with CDAC1 = 160 …200
Note 2:
MAS9280B1, MAS9280B2 and MAS9280B3 with CDAC1 = 160 …200
Note 3:
At 30 MHz to 40 MHz maximum Rs 30 ohm.
2 (8)
MAS [ MICRO ANALOG SYSTEMS ]
