DA9279.003
13 July 2006
IC OUTLINES
TE2
VDD
PV
DA
TE1
VDD
PV
DA
CLK
CLK
MAS9279
MAS9279
1506um
1506um
VC
X2
X1
VSS
OUT
TE2
VC
X2
X1
VSS
OUT
TE1
Die map reference
Die map reference
2202um
2202um
Figure 1. MAS9279A1, A3, A5, A7
Note 1: MAS9279 pads are round with 80 µm diameter at opening.
Figure 2. MAS9279A2, A4, A6, A8
Note 2: Pin CLK can either be connected to VSS or left floating, pin PV should be connected to Ground or left
floating and pin TE1 must be left floating in VCTCXO module end-user application.
Note 3: Die map reference is the actual left bottom corner of the sawn chip.
SAMPLES IN SB20 DIL PACKAGE
1
2
20
TE2
19
18
17
16
OUT
VSS
3
4
Top marking:
YYWW = Year, Week
XXXXX.X = Lot number
TE1
DA
X1
5
6
CLK
15
X2
PV
VC
14
13
7
8
9
VDD
12
11
10
4 (10)
MAS [ MICRO ANALOG SYSTEMS ]
