DA9279.003
13 July 2006
IC OUTLINES
VDD
PV
CLK
DA
TE1
VDD
PV
CLK
DA
TE2
1506um
MAS9279
1506um
MAS9279
VC
X2
X1
VSS
OUT
TE2
VC
X2
X1
VSS
OUT
TE1
Die map reference
2202um
Die map reference
2202um
Figure 1.
MAS9279A1, A3, A5, A7
Figure 2.
MAS9279A2, A4, A6, A8
Note 1:
MAS9279 pads are round with 80 µm diameter at opening.
Note 2:
Pin CLK can either be connected to VSS or left floating, pin PV should be connected to Ground or left
floating and pin TE1 must be left floating in VCTCXO module end-user application.
Note 3:
Die map reference is the actual left bottom corner of the sawn chip.
SAMPLES IN SB20 DIL PACKAGE
1
2
3
20
TE2
19
OUT
18
VSS
17
X1
MAS9279
YYWW
XXXXX.X
TE1
4
DA
5
CLK
6
PV
7
VDD
8
9
10
16
15
X2
14
VC
13
12
11
Top marking:
YYWW = Year, Week
XXXXX.X = Lot number
4 (10)
MAS [ MICRO ANALOG SYSTEMS ]
