DA9279.003
13 July 2006
PIN DESCRIPTION
Pin Description
Power Supply Voltage
Programming Input
Serial Bus Clock Input
Serial Bus Data Input
Temperature Output
Test Multiplexer Output
Voltage Control Input
Crystal Oscillator Output
Crystal/Varactor Oscillator Input
Power Supply Ground
Buffer Output
Symbol
VDD
PV
CLK
DA
TE1
TE2
VC
X1
X2
VSS
OUT
x-coordinate
149
561
1000
1565
2024
2016
147
1261
518
1549
1810
y-coordinate
1340
1340
1340
1340
1340
140
140
140
140
140
140
3
3
Note
Note:
Because the substrate of the die is internally connected to GND, the die has to be connected to GND or
left floating. Make sure that GND is the first pad to be bonded. Pick-and-place and all component assembly are
recommended to be performed in ESD protected area.
Note:
Pad coordinates are measured from the left bottom corner of the chip to the center of the pads. The
coordinates may vary depending on sawing width and location, however, distances between pads are accurate.
Note 3:
Valid for MAS9279A1, A3, A5 and A7. In MAS9279A2, A4, A6 and A8 TE1 and TE2 pins have been
swapped.
ABSOLUTE MAXIMUM RATINGS
Parameter
Supply Voltage
Input Pin Voltage
Power Dissipation
Storage Temperature
ESD Rating; HBM
Symbol
V
DD
- V
SS
P
MAX
T
ST
Min
-0.3
V
SS
-0.3
-55
Max
6.0
V
DD
+ 0.3
100
150
2
Unit
V
V
mW
o
C
kV
Note
1)
2)
Note 1:
Not valid for programming pin PV
Note 2:
In X1 and X2 pins maximum ESD rating is 1.5kV
RECOMMENDED OPERATION CONDITIONS
Parameter
Supply Voltage
Supply Current
Operating Temperature
Crystal Pulling Sensitivity
Crystal Pulling Sensitivity
Crystal Load Capacitance
Crystal Load Capacitance
Symbol
V
DD
I
CC
T
OP
S
S
C
L
C
L
Conditions
Vdd = 3.3 Volt
-40
24
28
Vc = 1.2V
Vc = 1.2V
Min
2.7
Typ
3.3
6.0
28
33
8
10
Max
5.5
+85
35
38
Unit
V
mA
o
C
ppm/pF
ppm/pF
pF
pF
Note
1
2
3
2
3
Note 1:
At 26MHz crystal
Note 2:
MAS9279A1, MAS9279A3, MAS9279A5, MAS9279A7
Note 3:
MAS9279A2, MAS9279A4, MAS9279A6, MAS9279A8
2 (10)
MAS [ MICRO ANALOG SYSTEMS ]
