DA9278.004
13 July 2006
PIN DESCRIPTION
Pin Description
Power Supply Voltage
Serial Bus Data Input
Serial Bus Clock Input
Programming Input
Voltage Control Input
Crystal Oscillator Output
Power Supply Ground
Crystal/Varactor Oscillator Input
Buffer Output
Symbol
VDD
DA
CLK
PV
VC
X1
VSS
X2
OUT
x-coordinate
177
435
201
1042
1012
374
830
817
665
y-coordinate
172
1015
1015
1015
158
158
1008
158
1015
Note:
Because the substrate of the die is internally connected to GND, the die has to be connected to GND or
left floating. Make sure that GND is the first pad to be bonded. Pick-and-place and all component assembly are
recommended to be performed in ESD protected area.
Note:
Pad coordinates are measured from the left bottom corner of the chip to the center of the pads. The
coordinates may vary depending on sawing width and location, however, distances between pads are accurate.
ABSOLUTE MAXIMUM RATINGS
Parameter
Supply Voltage
Input Voltage
Power Dissipation
Storage Temperature
Note:
Not valid for programming pin PV.
Symbol
V
DD
- V
SS
V
IN
P
MAX
T
ST
Min
-0.3
V
SS
-0.3
-55
Max
6.0
V
DD
+ 0.3
20
150
Unit
V
V
mW
o
C
Note
1)
RECOMMENDED OPERATION CONDITIONS
Parameter
Supply Voltage
Supply Current
Operating Temperature
Crystal Load Capacitance
Symbol
V
DD
I
CC
T
C
C
L
Conditions
Vcc = 2.8 Volt
-30
7.0
Min
2.7
Typ
2.8
0.85
Max
5.5
+85
Unit
V
mA
o
C
pF
2 (5)
MAS [ MICRO ANALOG SYSTEMS ]
