DA9187.002
29 January, 2004
PACKAGE (TSSOP-20) OUTLINES
e/ 2
A
VIEW B-B
b
E
E1
c1
c
12° REF
S
b1
INDEX AREA
GAUGE PLANE
e
R
A
0.25
12° REF
D
L1
L
A
A2
b
B
B
b
VIEW A-A
A1
Symbol
A
A1
A2
b
b1
c
c1
D
E
E1
e
L
L1
R
S
Min
--
0.05
0.85
0.19
0.19
0.09
0.09
6.40
4.30
0.50
0.09
--
Nom
--
--
0.90
--
0.22
--
--
6.50
6.4 BSC
4.40
0.65 BSC
0.60
1.00 REF
--
0.20
Max
1.10
0.15
0.95
0.30
0.25
0.20
0.16
6.60
4.50
0.75
--
--
Unit
mm
mm
mm
mm
mm
mm
mm
mm
mm
mm
mm
mm
mm
mm
Dimensions do not include mold or interlead flash, protrusions or gate burrs.
Reference Standard : JEDEC MO-153 .
SOLDERING INFORMATION
Resistance to Soldering Heat
Maximum Temperature
Maximum Number of Reflow Cycles
Reflow profile
Seating Plane Co-planarity
Lead Finish
According to RSH test IEC 68-2-58/20 2*220°C
240°C
2
Thermal profile parameters stated in JESD22-A113 should not
be exceeded.
http://www.jedec.org
max 0.08 mm
Solder plate 7.62 - 25.4
µm,
material Sn 85% Pb 15%
6 (7)
MAS [ MICRO ANALOG SYSTEMS ]
