DA9180.004
15 September, 2005
SOLDERING INFORMATION
N For Eutectic Sn/Pb TSSOP-16
Resistance to Soldering Heat
Maximum Temperature
Maximum Number of Reflow Cycles
Reflow profile
According to RSH test IEC 68-2-58/20 2*220°C
240°C
2
Thermal profile parameters stated in JESD22-A113 should not
be exceeded. http://www.jedec.org
max 0.08 mm
Seating Plane Co-planarity
Lead Finish
Solder plate 7.62 - 25.4 µm, material Sn 85% Pb 15%
N For Pb-Free, RoHS Compliant TSSOP-16
Resistance to Soldering Heat
Maximum Temperature
Maximum Number of Reflow Cycles
Reflow profile
According to RSH test IEC 68-2-58/20
260°C
3
Thermal profile parameters stated in IPC/JEDEC J-STD-020
should not be exceeded. http://www.jedec.org
max 0.08 mm
Seating Plane Co-planarity
Lead Finish
Solder plate 7.62 - 25.4 µm, material Matte Tin
12 (15)
MAS [ MICRO ANALOG SYSTEMS ]
