DA9180.004
15 September, 2005
PACKAGE (TSSOP16) OUTLINES
C
E
D
Seating Plane
B
F
G
B
H
A
O
Pin 1
Detail A
B
L
I
I1
K
P
Section B-B
J1
J
M
Detail A
N
Dimension
Min
Max
Unit
A
B
C
D
E
F
G
H
I
I1
J
J1
K
L
6.40 BSC
5.00 BSC
mm
mm
mm
mm
mm
mm
mm
mm
mm
mm
mm
mm
4.30
0.05
0.19
4.50
0.15
1.10
0.30
0.65 BSC
0.18
0.09
0.09
0.19
0.19
0°
0.28
0.20
0.16
0.30
0.25
8°
0.24
0.50
0.26
0.75
mm
mm
M
(The length of a terminal for
soldering to a substrate)
N
O
P
1.00 REF
12°
mm
12°
Dimensions do not include mold flash, protrusions, or gate burrs.
All dimensions are in accordance with JEDEC standard MO-153.
11 (15)
MAS [ MICRO ANALOG SYSTEMS ]
