DA9116.005
22 November, 2005
SOLDERING INFORMATION
N For Lead-Free / Green QFN 4mm x 5mm
Resistance to Soldering Heat
Maximum Temperature
Maximum Number of Reflow Cycles
Reflow profile
According to RSH test IEC 68-2-58/20
260°C
3
Thermal profile parameters stated in IPC/JEDEC J-STD-020
should not be exceeded. http://www.jedec.org
Solder plate 7.62 - 25.4 µm, material Matte Tin
Lead Finish
EMBOSSED TAPE SPECIFICATIONS, QFN 4x5 PACKAGE
P
1
D
0
PO
P2
T
X
E
W
F
B
0
R 0.5 typ
K0
X
A0
User Direction of Feed
Dimension
Min/Max
Unit
Ao
Bo
Do
E
mm
mm
mm
mm
mm
mm
mm
mm
mm
mm
mm
4.30
5.30
1.50 +0.1/-0.0
1.75
0.10
0.10
F
5.50
1.10
0.5
Ko
Po
P1
P2
T
0.10
4.0
8.0
2.0
0.3
0.10
0.05
0.05
W
12.00 0.3
All dimensions in millimeters
16 (18)
MAS [ MICRO ANALOG SYSTEMS ]
