DA9081.006
1 August, 2005
PACKAGE (TSSOP-16) OUTLINES
C
E
D
Seating Plane
B
A
O
Pin 1
Detail A
F
G
H
B
B
L
I
I1
K
P
Section B-B
J1
J
M
N
Detail A
Dimension
A
B
C
D
E
F
G
H
I
I1
J
J1
K
L
M
(The length of a terminal for
soldering to a substrate)
N
O
P
Min
6.40 BSC
4.30
5.00 BSC
0.05
0.19
0.65 BSC
0.18
0.09
0.09
0.19
0.19
0°
0.24
0.50
Max
4.50
0.15
1.10
0.30
0.28
0.20
0.16
0.30
0.25
8°
0.26
0.75
Unit
mm
mm
mm
mm
mm
mm
mm
mm
mm
mm
mm
mm
mm
mm
1.00 REF
12°
12°
mm
Dimensions do not include mold flash, protrusions, or gate burrs.
All dimensions are in accordance with JEDEC standard MO-153.
9 (12)