DA9081.006
1 August, 2005
MAS9081 PAD LAYOUT
9081Ax,
x=1, 3, 4 or 5
VDD
QO2
QO1
QI
AGC
PDN2
OUT
VSS
RFI2
RFIM
RFIP
PDN1
AON
DEC
1494
µ
m
DIE size = 1.49 x 1.69 mm; PAD size = 80 x 80
µm
Note:
Because the substrate of the die is internally connected to VDD, the die has to be connected to VDD or
left floating. Please make sure that VDD is the first pad to be bonded. Pick-and-place and all component
assembly are recommended to be performed in ESD protected area.
Note:
Coordinates are pad center points where origin has been located in bottom-left corner of the silicon die.
Pad Identification
Power Supply Voltage
Quartz Filter Output for Crystal 2
Quartz Filter Output for Crystal 1
Quartz Filter Input for Crystals
AGC Capacitor
Power Down/Frequency Selection Input 2
Receiver Output
Demodulator Capacitor
AGC On Control
Power Down/Frequency Selection Input 1
Positive Receiver Input
Negative Receiver Input
Receiver Input 2 (for Antenna Capacitor 2)
Power Supply Ground
Name
VDD
QO2
QO1
QI
AGC
PDN2
OUT
DEC
AON
PDN1
RFIP
RFIM
RFI2
VSS
X-coordinate
174
µm
174
µm
174
µm
174
µm
174
µm
174
µm
175
µm
1318
µm
1318
µm
1318
µm
1318
µm
1318
µm
1318
µm
1318
µm
Y-coordinate
1452
µm
1247
µm
1043
µm
839
µm
633
µm
430
µm
224
µm
240
µm
444
µm
648
µm
853
µm
1057
µm
1262
µm
1466
µm
Note
1688
µ
m
3
1
2
3
4
4
Notes:
1) OUT = VSS when carrier amplitude at maximum; OUT = VDD when carrier amplitude is reduced
(modulated)
-
the output is a current source/sink with |I
OUT
| > 5
µA
-
at power down the output is pulled to VSS (pull down switch)
2) AON = VSS means AGC off (hold current gain level); AON = VDD means AGC on (working)
-
Internal pull-up with current < 1
µA
which is switched off at power down
3) PDN1 = VDD and PDN2 = VDD means receiver off
-
Fast start-up is triggered when the receiver is after power down controlled to power up
4) Receiver inputs RFIP and RFIM have both 600 kΩ biasing resistances against ground
2 (12)
MAS [ MICRO ANALOG SYSTEMS ]
