DA9078.003
28 January 2004
SOLDERING INFORMATION
Resistance to Soldering Heat
Maximum Temperature
Maximum Number of Reflow Cycles
Reflow profile
Seating Plane Co-planarity
Lead Finish
According to RSH test IEC 68-2-58/20 2*220°C
240°C
2
Thermal profile parameters stated in JESD22-A113 should not
be exceeded.
http://www.jedec.org
max 0.08 mm
Solder plate 7.62 - 25.4
µm,
material Sn 85% Pb 15%
EMBOSSED TAPE SPECIFICATIONS
Tape Feed Direction
P
0
D
0
P
2
A
E
1
F
1
W
D
1
A
P
A
0
Tape Feed Direction
T
Section A - A
B
0
S
1
K
0
Dimension
A
0
B
0
D
0
D
1
E
1
F
1
K
0
P
P
0
P
2
S
1
T
W
Min
6.50
5.20
1.50 +0.10 / -0.00
1.50
1.65
7.20
1.20
11.90
4.0
1.95
0.6
0.25
11.70
2.05
0.35
12.30
1.85
7.30
1.40
12.10
Pin 1 Designator
Max
6.70
5.40
Unit
mm
mm
mm
mm
mm
mm
mm
mm
mm
mm
mm
mm
mm
8 (10)
MAS [ MICRO ANALOG SYSTEMS ]
