DA9012.001
25 August 2004
SOLDERING INFORMATION
Resistance to Soldering Heat
Maximum Temperature
Maximum Number of Reflow Cycles
Reflow profile
According to RSH test IEC 68-2-58/20 2*220°C
240°C
3
Thermal profile parameters stated in JESD22-A113 should not
be exceeded. http://www.jedec.org
max 0.08 mm
Seating Plane Co-planarity
Lead Finish
Solder plate 7.62 - 25.4 µm, material Sn 85% Pb 15%
EMBOSSED TAPE SPECIFICATIONS (TSSOP16)
Tape Feed Direction
A
P0
D0
P2
E1
F1
W
D1
A
A0
P
Tape Feed Direction
T
Section A - A
B0
S1
K0
Pin 1 Designator
Dimension
Min
Max
Unit
A0
B0
D0
D1
E1
F1
K0
P
6.50
6.70
mm
mm
mm
mm
mm
mm
mm
mm
mm
mm
mm
mm
mm
5.20
5.40
1.50 +0.10 / -0.00
1.50
1.65
7.20
1.20
11.90
1.85
7.30
1.40
12.10
P0
P2
S1
T
4.0
1.95
0.6
2.05
0.25
11.70
0.35
W
12.30
10 (12)
MAS [ MICRO ANALOG SYSTEMS ]
