DA9012.001
25 August 2004
PACKAGE (TSSOP16) OUTLINES
C
D
Seating Plane
B
A
F
G
H
E
O
Pin 1
Detail A
B
B
L
I
I1
K
P
Section B-B
J1
J
M
N
Detail A
Dimension
A
B
C
D
E
F
G
H
I
I1
J
J1
K
L
M
(The length of a terminal for
soldering to a substrate)
N
O
P
Min
6.40 BSC
4.30
5.00 BSC
0.05
0.19
0.65 BSC
0.18
0.09
0.09
0.19
0.19
0°
0.24
0.50
1.00 REF
12°
12°
Max
4.50
0.15
1.10
0.30
0.28
0.20
0.16
0.30
0.25
8°
0.26
0.75
Unit
mm
mm
mm
mm
mm
mm
mm
mm
mm
mm
mm
mm
mm
mm
mm
Dimensions do not include mold flash, protrusions, or gate burrs.
All dimensions are in accordance with JEDEC standard MO-153.
9 (12)