DA9011.001
28 Jan 2004
SOLDERING INFORMATION
◆
For Lead-Free TSOT-5
Resistance to Soldering Heat
Maximum Temperature
Maximum Number of Reflow Cycles
Reflow profile
Seating Plane Co-planarity
Lead Finish
According to RSH test IEC 68-2-58/20
260°C
3
Thermal profile parameters stated in JESD22-A113 should not
be exceeded.
http://www.jedec.org
max 0.08 mm
Solder plate 7.62 - 25.4 µm, material Matte Tin
TAPE & REEL SPECIFICATIONS (TSOT-5)
W3
W2
Feeding Direction
A
D
C
N
8 mm
W1
B
4 mm
Other Dimensions according to EIA-481 Standard
3000 Components on Each Reel
Dimension
A
B
C
D
N
W
1
(measured at hub)
W
2
(measured at hub)
W
3
(includes flange distortion at outer edge)
Trailer
Leader
Min
1.5
12.80
20.2
50
8.4
7.9
160
390,
of which minimum 160 mm of
empty carrier tape sealed with
cover tape
Max
178
13.50
9.9
14.4
10.9
Unit
mm
mm
mm
mm
mm
mm
mm
mm
mm
mm
8 (9)
MAS [ MICRO ANALOG SYSTEMS ]
