DA9011.001
28 Jan 2004
PAD LAYOUT
670
µm
GND
VDD
SOL
MAS
9011
PO
LB
DIE size = 0.67 mm x 1.43 mm
PAD size = 80 x 80
µm
Note:
Make sure that VDD is the first pad to be bonded. Pick-and-place and all component assembly are
recommended to be performed in ESD protected area.
Note:
If the die is to be placed on metal plane, the metal plane should be connected to VDD or left floating. This
because the substrate of the die is internally connected to VDD.
Note:
Coordinates are pad center points where origin has been located in bottom-left corner of the silicon die.
Pad Identification
Power Supply Ground
Power Supply Voltage
Full Battery Output
Power On Output
Low Battery Output
Name
GND
VDD
SOL
PO
LB
X-coordinate
174
µm
334
µm
495
µm
211
µm
462
µm
Y-coordinate
1208
µm
1210
µm
1221
µm
221
µm
221
µm
1434
µm
2 (9)
MAS [ MICRO ANALOG SYSTEMS ]
