DA6501.001
27 October 2008
MAS6501 PAD LAYOUT
µ
1740 m
6501
Die dimensions 1740 µm x 2090 µm; round PAD ∅ 80 µm
Note: Because the substrate of the die is internally connected to GND, the die has to be placed over a GND
plate on PCB or left floating. Please make sure that GND is the first pad to be bonded. Pick-and-place and all
component assembly are recommended to be performed in ESD protected area.
Note: Coordinates are pad center points where origin has been located in the center of the silicon die.
Pad Identification
Name
X-coordinate
Y-coordinate
End of Conversion
Power Supply
EOC
VDD
MCLK
XCLR
SDA
-713 µm
-450 µm
-200 µm
-18 µm
-839 µm
-839 µm
-839 µm
-839 µm
-839 µm
-839 µm
839 µm
839 µm
839 µm
839 µm
839 µm
839 µm
Master Clock
Clear I2C, Stop Conversion
Serial Bus Data Input/Output
Serial Bus Clock
Supply Ground
318 µm
726 µm
-713 µm
-450 µm
-200 µm
-18 µm
SCL
GND
COMMON
PI
Sensor Ground
ADC Positive Input
Test Pin 2
TE2
ADC Negative Input
Test Pin 1
NI
318 µm
726 µm
TE1
Note: Test pins TE1 and TE2 must be left floating.
10 (16)
MAS [ MICRO ANALOG SYSTEMS ]
