DA6512.003
2 December, 2016
SOLDERING INFORMATION
For Lead-Free / Green QFN 4mm x 4mm
Resistance to Soldering Heat
Maximum Temperature
Maximum Number of Reflow Cycles
Reflow profile
According to RSH test IEC 68-2-58/20
260C
3
Thermal profile parameters stated in IPC/JEDEC J-STD-020
should not be exceeded. http://www.jedec.org
Solder plate 7.62 - 25.4 µm, material Matte Tin
Lead Finish
EMBOSSED TAPE SPECIFICATIONS
P1
D0
PO
P2
T
X
E
W
F
B0
R 0.25 typ
K0
X
A0
User Direction of Feed
Orientation on tape
Dimension
Min/Max
Unit
Ao
Bo
Do
E
4.30 ±0.10
4.30 ±0.10
1.50 +0.1/-0.0
1.75
5.50 ±0.05
1.10 ±0.10
4.0
mm
mm
mm
mm
mm
mm
mm
mm
mm
mm
mm
F
Ko
Po
P1
P2
T
8.0
2.0
0.3
±0.10
±0.05
±0.05
W
12.00 ±0.3
All dimensions in millimeters
30 (32)
MAS [ MICRO ANALOG SYSTEMS ]
