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MAS6505BA1WAD00 参数 Datasheet PDF下载

MAS6505BA1WAD00图片预览
型号: MAS6505BA1WAD00
PDF下载: 下载PDF文件 查看货源
内容描述: [Piezoresistive Sensor Signal Interface IC]
分类和应用:
文件页数/大小: 44 页 / 1063 K
品牌: MAS [ MICRO ANALOG SYSTEMS ]
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DA6505.005  
11 June 2018  
MAS6505 IN QFN-24 4x4x0.85 PACKAGE  
Top Marking Information:  
MAS6505 = Product Number  
VVV = Product Version  
YYWW = Year Week  
XXXXX = Lot Number  
QFN-24 4x4x0.85 PIN DESCRIPTION  
Pin Name  
Pin  
Type  
Function  
Notes  
SCK  
SDI  
1
2
DI  
Serial bus clock input in I2C and SPI  
DI/O  
Data input/output in I2C  
Data input in 4-wire SPI / Data input/output in 3-wire SPI  
Bus mode select / chip select with pull-up  
CSB=VDDIO: I2C mode / chip not selected  
CSB=GND: SPI mode / chip selected  
CSB  
3
DI  
1
VDDIO  
VDD  
4
5
P
P
Positive supply voltage for serial bus interface  
2
3
Positive supply voltage  
6-7  
8
NC  
G
GND  
GNDS  
NI  
Supply ground  
9
AO  
AI  
Sensor bridge supply ground  
Negative sensor signal input  
EEPROM test  
10  
11  
12  
13-20  
21  
22  
23  
24  
ETEST  
PI  
AI/O  
AI  
4
3
Positive sensor signal input  
NC  
P
VDDS  
TD  
Supply voltage for sensor bridge and external sensing diode  
External temperature sensing diode cathode connection  
AI/O  
NC  
DO  
5
3
6
SDO  
Data output in 4-wire SPI mode  
Test input/output in test mode  
NC = Not Connected, P = Power, G = Ground, DO = Digital Output, DI = Digital Input, AO = Analog Output, AI = Analog Input  
Note 1: In I2C mode the unused CSB pin must be left unconnected (floating). The CSB pin has internal 250 kΩ pull-up resistor to VDDIO.  
To minimize current consumption the pin should be kept high (at VDDIO) except during chip select events of SPI bus communication mode.  
Note 2: If there is no separate supply voltage available for the serial bus interface the VDDIO must be tied to VDD.  
Note 3: The not connected (NC) pins should be connected to supply ground (GND) for minimum noise.  
Note 4: The ETEST pin must be left unconnected (floating). It is only for EEPROM testing purpose.  
Note 5: Optional external temperature sensing diode is connected between VDDS (anode) and TD (cathode). The unused TD pin is left  
unconnected.  
Note 6: In I2C and 3-wire SPI modes the unused SDO pin must be left unconnected (floating).  
Note: On PCB the exposed pad is recommended to be connected to GND for minimum noise. It can be also left floating but it cannot be  
connected to any other potential than GND.  
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