DA6285.002
11 November, 2010
SOLDERING INFORMATION (QFN-6)
N
For Lead-Free / RoHS Compliant Green QFN
Resistance to Soldering Heat
Maximum Temperature
Maximum Number of Reflow Cycles
Reflow profile
According to RSH test IEC 68-2-58/20
260
3
°C
Thermal profile parameters stated in IPC/JEDEC J-STD-020
should not be exceeded. http://www.jedec.org
7.62 - 25.4 µm, Matte Tin
Lead Finish
EMBOSSED TAPE SPECIFICATIONS (QFN-6)
Pin 1 orientation / top view
DO
P
O
T
P
2
P1
X
E
10OMAX
W
F
B
0
X
K
0
A0
User Direction of Feed
Detail X-X
Dimension
Min/Max
Unit
Ao
Bo
Do
E
mm
mm
mm
mm
mm
mm
mm
mm
mm
mm
mm
2.30
2.30
1.50 +0.1/-0.0
0.05
0.05
1.75
3.50
1.00
0.10
0.05
0.05
F
Ko
Po
P1
P2
T
4.0
4.0
2.0
0.10
0.05
0.254
0.02
W
8.00 0.3/-0.1
10 (12)
MAS [ MICRO ANALOG SYSTEMS ]
