DA6240.001
20 November 2006
PIN DESCRIPTION
Pin Description
Symbol Type X-coordinate
Y-coordinate
Control signal input for setting charge pump mode
Control signal input for setting charge pump mode
Enable signal + Digital signal input
Flying capacitor negative terminal
Supply ground
EN1
EN2
DIN
DI
DI
152 µm
152 µm
152 µm
672 µm
808 µm
980 µm
980 µm
980 µm
980 µm
765 µm
612 µm
447 µm
989 µm
804 µm
588 µm
200 µm
202 µm
225 µm
378 µm
558 µm
711 µm
1000 µm
1000 µm
999 µm
DI
CN1
GND
VO2
VO1
CN2
CP1
VOUT
CP2
VIN
I/O
G
Digital audio signal output
DO
DO
I/O
I/O
AO
I/O
P
Digital audio signal output
Flying capacitor negative terminal
Flying capacitor positive terminal
Charge pump output
Flying capacitor positive terminal
Power supply
G = Ground, P = Power, D = Digital, A = Analog, I = Input, O = Output.
Note: Because the substrate of the die is internally connected to GND, the die has to be connected to GND or
left floating. Please make sure that GND is the first pad to be bonded. Pick-and-place and all component
assembly are recommended to be performed in ESD protected area.
Note: Pad coordinates are measured from the left bottom corner of the chip to the center of the pads. The
coordinates may vary depending on sawing width and location, however, distances between pads are accurate.
Note: See IC outlines on a page 6 for IC layout.
ABSOLUTE MAXIMUM RATINGS
Parameter
Supply Voltage
Symbol
Conditions
Min
Max
Unit
VIN
-0.3
-0.3
5.5
10
V
V
Outputs and Flying
Capacitors Pins Voltages
VOUT,
CP1, CP2,
CN1, CN2,
VO1, VO2
DIN,
Voltage Range for Input
Pins
VOUT Short-Circuit
Duration
Storage Temperature
-0.3
-55
VIN + 0.3
Indefinite
V
EN1, EN2
tSC
Note 1
+150
1
oC
kV
ESD Rating
Human Body Model (HBM)
NOTE 1. SHORT CIRCUIT CURRENT INTERNALLY LIMITED.
RECOMMENDED OPERATING CONDITIONS
All voltages with respect to ground.
Parameter
Symbol
Conditions
Min
Typ
Max
Unit
Operating Junction
Temperature
TJ
-40
+125
°C
Operating Ambient
Temperature
Operating Supply Voltage
TA
-40
2.5
+27
3.0
+85
3.3
°C
V
VIN
3 (10)