DA6240C.007
17 October, 2016
SOLDERING INFORMATION
For Lead-Free / Green QFN 2mm x 2mm x 0.5mm and 3mm x 3mm x 0.75mm
Resistance to Soldering Heat
Maximum Temperature
Maximum Number of Reflow Cycles
Reflow profile
According to RSH test IEC 68-2-58/20
260C
3
Thermal profile parameters stated in IPC/JEDEC J-STD-020
should not be exceeded. http://www.jedec.org
7.62 - 25.4 µm, Matte Tin
Lead Finish
QFN 2x2x0.5 EMBOSSED TAPE SPECIFICATIONS
User Direction of Feed
Orientation on tape
Dimension
Min/Max
Unit
A0
B0
D
D1
E
F
K0
P
P0
10P0
P2
t
W
2.13 ±0.05
2.13 ±0.05
1.50 ±0.1
mm
mm
mm
mm
mm
mm
mm
mm
mm
mm
mm
mm
mm
°
1.00 +0.25/-0.00
1.75 ±0.10
3.50 ±0.05
0.88 ±0.05
4.00 ±0.10
4.00 ±0.10
40.00 ±0.20
2.00
0.254
±0.05
±0.02
8.00 +0.3/-0.1
5 MAX
Reel Material: Conductive, Plastic Antistatic or Static Dissipative
Carrier Tape Material: Conductive
Cover Tape Material: Static Dissipative
11 (13)
MAS [ MICRO ANALOG SYSTEMS ]
