DA6116.001
27 February, 2009
SO-16 PACKAGE OUTLINE
16 LEAD SO OUTLINE (300 MIL BODY)
1.27
TYP.
0-0.13
RAD.
0.36
0.48
5°TYP.
5°TYP
0.33 x 45°
5°TYP.
0.25 RAD.
MIN.
SEATING
PLANE
5°TYP.
5°TYP.
10.10
10.50
PIN 1
ALL MEASUREMENTS IN mm
All dimensions are in accordance with JEDEC standard MS-013.
SOLDERING INFORMATION
N For Lead-Free / Green QFN 4mm x 5mm
Resistance to Soldering Heat
Maximum Temperature
Maximum Number of Reflow Cycles
Reflow profile
According to RSH test IEC 68-2-58/20
260°C
3
Thermal profile parameters stated in IPC/JEDEC J-STD-020
should not be exceeded. http://www.jedec.org
Solder plate 7.62 - 25.4 µm, material Matte Tin
Lead Finish
16 (18)
MAS [ MICRO ANALOG SYSTEMS ]
