DA6180C.001
17 September, 2014
MAS6180 PAD LAYOUT
VSS pad
bonded first!
1160 µm
VDD
VSS
RFIM
QOP
QOM
QI
MAS6180Cx
RFIP
PDN
AON
DEC
AGC
OUT
DIE size = 1160 µm x 1320 µm; PAD size = 80 µm x 80 µm
Note: Because the substrate of the die is internally connected to VSS, the die has to be connected to VSS or left
floating. Please make sure that VSS is the first pad to be bonded. Pick-and-place and all component assembly
are recommended to be performed in ESD protected area.
Note: Coordinates are pad center points where origin has been located in bottom-left corner of the silicon die.
Pad Identification
Name
X-coordinate
Y-coordinate
Note
Power Supply Voltage
Positive Quartz Filter Output
Negative Quartz Filter Output
Quartz Filter Input for Crystal
AGC Capacitor
VDD
QOP
QOM
QI
126 µm
126 µm
126 µm
126 µm
126 µm
126 µm
1034 µm
1034 µm
1034 µm
1034 µm
1034 µm
1034 µm
1122 µm
955 µm
787 µm
604 µm
435 µm
258 µm
261 µm
445 µm
613 µm
802 µm
980 µm
1111 µm
1
2
AGC
OUT
DEC
AON
PDN
RFIP
RFIM
VSS
Receiver Output
Demodulator Capacitor
AGC On Control
3
4
5
5
Power Down
Positive Receiver Input
Negative Receiver Input
Power Supply Ground
Notes:
1) QOM bonding pad is electrically unconnected in MAS6180C1 version
2) OUT = VSS when carrier amplitude at maximum; OUT = VDD when carrier amplitude is reduced (modulated)
-
the output is a current source/sink with |IOUT| > 5 µA
at power down the output is pulled to VSS (pull down switch)
-
3) AON = VSS means AGC off (hold current gain level); AON = VDD means AGC on (working)
Internal pull-up with current < 1 µA which is switched off at power down
4) PDN = VSS means receiver on; PDN = VDD means receiver off
-
Fast start-up is triggered when the receiver is after power down (PDN=VDD) controlled to power up
(PDN=VSS) i.e. at the falling edge of PDN signal.
5) Receiver inputs RFIP and RFIM have both 1.4 MΩ biasing resistors towards VDD
2 (12)
MAS [ MICRO ANALOG SYSTEMS ]
