DA6011.000
15 September 2008
PAD LAYOUT: MAS6011AA3
1040
µ
m
MAS6011
GND
XPD
SOL
VDD
LB
DIE size = 1040 mm x 1540 mm
PAD size = 80 x 80
µm
Note:
This is a CMOS device and therefore it should be handled carefully to avoid any damage by static voltages
(ESD). Make sure that GND is the first pad to be bonded. Pick-and-place and all component assembly are
recommended to be performed in ESD protected area.
Note:
If the die is to be placed on metal plane, the metal plane should be connected to GND or left floating
because the substrate of the die is internally connected to GND.
Note:
Coordinates are pad center points where origin has been located in the center of the silicon die.
Pad Identification
Power Supply Ground
Power Down Output
Solar Charging Output
Power Supply Voltage
Low Battery Output
Name
GND
XPD
SOL
VDD
LB
X-coordinate
-129
µm
253
µm
-167
µm
102
µm
253
µm
1540
µ
m
Y-coordinate
563
µm
563
µm
-563
µm
-563
µm
-563
µm
2 (8)
MAS [ MICRO ANALOG SYSTEMS ]
